Light emitting lamp

ABSTRACT

Disclosed is a light emitting lamp including a light source module including at least one light source and a light guide layer disposed on a substrate burying the at least one light source, and a housing accommodating the light source module, and the at least one light source includes a body having a cavity, a first lead frame including one end exposed to the cavity and the other end passing through the body and exposed to one surface of the body, a second lead frame including one end exposed to one portion of the surface of the body, the other end exposed to the another portion of the surface of the body, and an intermediate part exposed to the cavity, and at least one light emitting chip including a first semiconductor layer, an active layer and a second semiconductor layer, and disposed on the first lead frame.

CROSS-REFERENCE TO RELATED APPLICATION(S)

The present application is a Continuation of co-pending U.S. patentapplication Ser. No. 13/684,362 filed on Nov. 23, 2012, which claimspriority under 35 U.S.C. §119 to Korean Patent Application No.10-2012-0036648, filed on Apr. 9, 2012, whose entire disclosures arehereby incorporated by reference.

BACKGROUND

1. Field

Embodiments relate to a lamp which emits light.

2. Background

Lamps refer to apparatuses which supply or adjust light for a specificpurpose. As light sources of lamps, incandescent light bulbs,fluorescent lights and neon lights may be used, and recently, lightemitting diodes (LEDs) are used.

The LEDs are devices which convert an electrical signal into ultravioletlight or visible light using characteristics of a compoundsemiconductor. The LEDs do not use harmful materials, such as mercury,differently from fluorescent lights, and thus cause minimalenvironmental contamination. Further, the lifespan of the LEDs is longerthan those of incandescent light bulbs, fluorescent lights and neonlights. Further, as compared with incandescent light bulbs, fluorescentlights and neon lights, the LEDs have advantages, such as a low powerconsumption rate and excellent visibility and little glare due to a highcolor temperature.

Lamps using LEDs may be used in a backlight, a display device, anillumination light, an indicator lamp for vehicles, and a head lampaccording to purposes thereof.

A lamp may include an LED package mounted on a substrate. The LEDpackage may include a package body and light emitting chips disposed onthe package body. The temperature of the light emitting chips isincreased when the lamp emits light. Since characteristics (for example,brightness and wavelength) of the light emitting chips may be changedaccording to increase of the temperature, heat dissipation measures tosuppress increase of the temperature of the light emitting chips arerequired.

The above references are incorporated by reference herein whereappropriate for appropriate teachings of additional or alternativedetails, features and/or technical background.

SUMMARY

Embodiments provide a light emitting lamp which has a thin profile,improves a degree of freedom in product design and heat dissipationefficiency and suppresses wavelength shift and brightness reduction.

In one embodiment, a light emitting lamp includes a light source moduleincluding at least one light source disposed on a substrate and a lightguide layer disposed on the substrate burying the at least one lightsource, and a housing accommodating the light source module, wherein theat least one light source includes a body having a cavity, a first leadframe including one end exposed to the cavity and the other end passingthrough the body and exposed to one surface of the body, a second leadframe including one end exposed to one portion of the surface of thebody, the other end exposed to another portion of the surface of thebody, and an intermediate part exposed to the cavity, and at least onelight emitting chip including a first semiconductor layer, an activelayer and a second semiconductor layer, and disposed on the first leadframe.

The first lead frame may include a first upper surface part which isexposed to the cavity and on which the at least one light emitting chipis disposed, and a first side surface part bent from a first sideportion of the first upper surface part and exposed to the surface ofthe body.

The first lead frame may further include at least one through holeformed adjacent to a boundary part between the first upper surface partand the first side surface part.

The first lead frame may further include connection parts connecting thefirst upper surface part and the first side surface part, and the atleast one through hole is located between the connection parts.

The length of a first connection part aligned with the at least onelight emitting chip from among the connection parts may be greater thanthe length of a second connection part not aligned with the at least onelight emitting chip, and the first direction may be the X-axis directionin an XYZ coordinate system.

The second lead frame may include a second upper surface part disposedaround at least one side portion of the first upper surface part andexposed to the cavity of the body, and a second side surface part bentfrom the second upper surface part and exposed respectively to the oneportion and the another portion of the surface of the body.

The light source module may further include a heat dissipation memberdisposed on the lower surface of the substrate. The at least one lightsource may be a side view type light emitting device package. Thesubstrate may include at least one via hole. The light source module maybe a surface light source.

The light source module may further include a reflective sheet disposedbetween the substrate and the light guide layer. The light source modulemay further include reflective patterns disposed on the reflectivesheet. The light source module may further include a first optical sheetdisposed on the light guide layer and dispersing light emitted from thelight guide layer. The light source module may further include opticalpatterns disposed on the first optical sheet and blocking or reflectinglight emitted from the at least one light source. The light sourcemodule may further include a second optical sheet disposed on the firstoptical sheet and the optical patterns. The light source module mayfurther include a diffusion plate disposed on the second optical sheet.

The light guide layer may be formed of a UV curable resin including anoligomer. The UV curable resin may include at least one selected fromamong the group consisting of urethane acrylate, epoxy acrylate,polyester acrylate, polyether acrylate, polybutadiene acrylate andsilicon acrylate.

The light guide layer may be formed of a thermosetting resin includingat least one selected from among the group consisting of a polyesterpolyol resin, an acryl polyol resin, a hydrocarbon-based solvent and/oran ester-based solvent.

The light guide layer may include a diffusion material diffusing lightincluding at least one selected from the group consisting of silicon,silica, glass bubbles, PMMA, urethane, Zn, Zr, Al2O3 and acryl.

The light source module may further include at least one connectordisposed on the substrate to be electrically connected to the outside.The substrate may include a coupling fixing part to be coupled with theoutside. The light emitting lamp may further include a plurality oflenses disposed on the diffusion plate. The substrate may include acircuit pattern and an insulating layer, and have flexibility.

The at least one light emitting chip may emit red light having awavelength range of 600 nm˜690 nm.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments will be described in detail with reference to thefollowing drawings in which like reference numerals refer to likeelements wherein:

Arrangements and embodiments may be described in detail with referenceto the following drawings in which like reference numerals refer to likeelements and wherein:

FIG. 1 is a perspective view illustrating a light emitting lamp inaccordance with one embodiment;

FIGS. 2 to 20 are cross-sectional views illustrating light sourcemodules shown in FIG. 1 in accordance with first to nineteenthembodiments;

FIG. 21 is a view illustrating reflective patterns shown in FIG. 4 inaccordance with one embodiment;

FIG. 22 is a cross-sectional view illustrating a light source moduleshown in FIG. 1 in accordance with a twentieth embodiment;

FIG. 23 is a plan view illustrating a light source module shown in FIG.1 in accordance with a twenty first embodiment;

FIG. 24 is a cross-sectional view of the light source module shown inFIG. 23, taken along the line A-A′;

FIG. 25 is a cross-sectional view of the light source module shown inFIG. 23, taken along the line B-B′;

FIG. 26 is a cross-sectional view of the light source module shown inFIG. 23, taken along the line C-C′;

FIG. 27 is a perspective view illustrating a head lamp for vehicles inaccordance with one embodiment;

FIG. 28 is a perspective view of a light emitting device package inaccordance with a first embodiment;

FIG. 29 is a top view of the light emitting device package in accordancewith the first embodiment;

FIG. 30 is a front view of the light emitting device package inaccordance with the first embodiment;

FIG. 31 is a side view of the light emitting device package inaccordance with the first embodiment;

FIG. 32 is a perspective view illustrating a first lead frame and asecond lead frame shown in FIG. 28;

FIG. 33 is a cross-sectional view illustrating sizes of respective partsof the first lead frame and the second lead frame shown in FIG. 32;

FIG. 34 is an enlarged view illustrating connection parts shown in FIG.33;

FIGS. 35 to 40 are cross-sectional views illustrating first lead framesand second lead frames in accordance with other embodiments;

FIG. 41 is a perspective view of a light emitting device package inaccordance with another embodiment;

FIG. 42 is a top view of the light emitting device package shown in FIG.41;

FIG. 43 is a front view of the light emitting device package shown inFIG. 41;

FIG. 44 is a cross-sectional view of the light emitting device packageshown in FIG. 41, taken along the line c-d;

FIG. 45 is a perspective view illustrating a first lead frame and asecond lead frame shown in FIG. 41;

FIG. 46 is a graph illustrating measured temperatures of light emittingdevice packages in accordance with embodiments;

FIG. 47 is a cross-sectional view of a light emitting chip shown in FIG.28 in accordance with one embodiment;

FIG. 48 is an exploded perspective view of a light emitting lamp inaccordance with another embodiment;

FIG. 49 is a perspective view illustrating a general head lamp forvehicles which is a point light source;

FIG. 50 is a perspective view illustrating a tail lamp for vehicles inaccordance with one embodiment;

FIG. 51 is a perspective view illustrating a general tail lamp forvehicles; and

FIGS. 52A and 52B are views illustrating intervals between lightemitting device packages of light source modules used in tail lamps forvehicles in accordance with embodiments.

DETAILED DESCRIPTION

Hereinafter, embodiments will be described with reference to the annexeddrawings.

It will be understood that when an element is referred to as being “on”or “under” another element, it can be directly on/under the element, andone or more intervening elements may also be present. When an element isreferred to as being “on” or “under”, “under the element” as well as “onthe element” can be included based on the element.

In the drawings, the thicknesses or sizes of respective layers areexaggerated, omitted, or schematically illustrated for convenience andclarity of description. Further, the sizes of the respective elements donot denote the actual sizes thereof. Hereinafter, a light emitting lampin accordance with one embodiment will be described with reference tothe annexed drawings.

FIG. 1 is a perspective view illustrating a light emitting lamp 1 inaccordance with one embodiment.

With reference to FIG. 1, the light emitting lamp 1 includes a lightsource module 100 which is a surface light source, and a housing 150 toaccommodate the light source module 100.

The light source module 100 includes at least one light emitting device20 which emits light, diffuses and disperses point light emitted fromthe light emitting device 20 to produce surface light, and hasflexibility and may thus be bent.

The housing 150 protects the light source module 100 from impact, andmay be formed of a material (for example, acryl) which transmits lightirradiated from the light source module 100. Further, the housing 150may include a bent part, and the light source module 100 havingflexibility may be easily accommodated in the bent housing 150.

FIG. 2 illustrates a light source module 100-1 shown in FIG. 1 inaccordance with a first embodiment.

FIG. 2 is a cross-sectional view taken along the line A-B of FIG. 1.With reference to FIG. 2, the light source module 100-1 includes aflexible printed circuit board 10, light emitting devices 20 and a lightguide layer 40.

The flexible printed circuit board 10 may be a printed circuit boardformed of an insulating material having flexibility. For example, theflexible printed circuit board 10 may include a base member (forexample, 5) and circuit patterns (for example, 6 and 7) disposed on atleast one surface of the base member (for example, 5). The base member(for example, 5) may be a film having flexibility and insulatingproperties, for example, polyimide or epoxy (for example, FR-4).

The flexible printed circuit board 10 may include the insulating film 5(for example, polyimide or RF-4), a first copper foil pattern 6, asecond copper foil pattern 7, and via contacts 8. The first copper foilpattern 6 is formed on one surface (for example, the upper surface) ofthe insulating film 5, the second copper foil pattern 7 is formed on theother surface (for example, the lower surface) of the insulating film 5,and the via contacts 8 may pass through the insulating film 5 andconnect the first copper foil pattern 6 and the second copper foilpattern 7.

One or more light emitting devices 20 are disposed on the flexibleprinted circuit board 10, and emit light. For example, the lightemitting devices 20 may be side view type light emitting device packageswhich are disposed so that emitted light proceeds in a sidewarddirection 3 of the light guide layer 40. Here, a light emitting chipmounted on the light emitting device package may be a vertical typelight emitting chip, for example, a red light emitting chip shown inFIG. 47, but the disclosure is not limited thereto.

The light guide layer 40 may be disposed on the flexible printed circuitboard 10 and the light emitting devices 20 so as to bury the lightemitting devices 20, and diffuse and induce light, emitted from thelight emitting devices 20 in the sideward direction 3 of the light guidelayer 40, in a direction toward one surface (for example, the uppersurface) of the light guide layer 40.

The light guide layer 40 may be formed of a resin of a material whichmay diffuse light. For example, the light guide layer 40 may be formedof a highly thermally resistant UV curable resin including an oligomer.Here, the oligomer may have a content of 40 to 50 parts by weight.Further, the UV curable resin may use urethane acrylate, but thedisclosure is not limited thereto. That is, in addition to urethaneacrylate, the UV curable resin may use at least one material from amongepoxy acrylate, polyester acrylate, polyether acrylate, polybutadieneacrylate and silicon acrylate.

Particularly, if urethane acrylate is used as the oligomer, two types ofurethane acrylate may be mixed so as to simultaneously achieve differentphysical properties.

For example, isocyanate is used during a process of compounding urethaneacrylate, and physical properties (yellow coloring property, weatherresistance, chemical resistance, etc.) of urethane acrylate may bedetermined by isocyanate. Here, as one kind of urethane acrylate,urethane acrylate type-isocyanate in which NCO of isophoronediisocyanate (IPD) or isophorone diisocyanate (IPDI) has a content of37% (hereinafter, referred to as ‘a first oligomer’) is used, and as theother kind of urethane acrylate, urethane acrylate type-isocyanate inwhich NCO of isophorone diisocyanate (PDI) or isophorone diisocyanate(IPDI) has a content of 30˜50% or 25˜35% (hereinafter, referred to as ‘asecond oligomer’), thereby forming the oligomer forming the light guidelayer 40 in accordance with the embodiment. That is, the first oligomerand the second oligomer having different physical properties may beobtained by adjusting the content of NCO, and may be mixed to form theoligomer forming the light guide layer 40. Here, the weight rate of thefirst oligomer may be in the range of 15 to 20, and the weight rate ofthe second oligomer may be in the rage of 25 to 35.

The light guide layer 40 may further include at least one of a monomerand a photo initiator. Here, the monomer may have a content of 65 to 90parts by weight, and in more detail, the monomer may be formed of amixture including isobornyl acrylate (IBOA) of 35˜45 parts by weight,2-hydroxyethyl methacrylate (2-HEMA) of 10˜15 parts by weight and2-hydroxybutyl acrylate (2-HBA) of 15˜20 parts by weight. Further, thephoto initiator (for example, 1-hydroxycyclohexyl phenyl-ketone,diphenyl, diphenyl (2,4,6-trimethylbezoyl phosphine oxide, etc) may havea content of 0.5˜1 parts by weight.

Further, the light guide layer 40 may be formed of a highly thermallyresistant thermosetting resin. In more detail, the light guide layer 40may be formed of a thermosetting resin including at least one of apolyester polyol resin, an acryl polyol resin, a hydrocarbon-basedsolvent and/or an ester-based solvent. Such a thermosetting resin mayinclude a thermal hardener to improve film strength.

The polyester polyol resin may have a content of 9˜30% with respect tothe overall weight of the thermosetting resin. Further, the acryl polyolresin may have a content of 20˜40% with respect to the overall weight ofthe thermosetting rein.

The hydrocarbon-based solvent and/or the ester-based solvent may have acontent of 30˜70% with respect to the overall weight of thethermosetting rein. The thermal hardener may have a content of 1˜10%with respect to the overall weight of the thermosetting rein.

If the light guide layer 40 is formed of the above-described material,the light guide layer 40 has reinforced thermal resistance, and even ifthe light source module 100-1 is used in a light emitting lamp emittingheat of a high temperature, lowering of brightness due to heat may beminimized and thus a light emitting lamp having high reliability may beprovided.

Further, the light source module 100-1 in accordance with thisembodiment uses the above-described material to achieve a surface lightsource, and may thus greatly reduce the thickness of the light guidelayer 40 and achieve a thin profile of the entirety of a product.Further, the light source module 100-1 in accordance with thisembodiment is flexible, and may thus be easily applied to a bentsurface, improve a degree of freedom in design and be applied to otherflexible displays.

The light guide layer 40 may include a diffusion material 41 providedwith apertures (or holes), and the diffusion material 41 may be mixedwith or diffused in the resin forming the light guide layer 40 and serveto improve reflecting and diffusing properties of light.

For example, light emitted from the light emitting devices 20 to theinside of the light guide layer 40 is reflected and transmitted by theapertures of the diffusion material 41 and is diffused and collected inthe light guide layer 40, and the diffused and collected light may beemitted through one surface (for example, the upper surface) of thelight guide layer 40. Here, the diffusion material 41 increasesreflectivity and diffusivity of light and improves the amount anduniformity of light emitted through an upper surface of the light guidelayer 40, consequently improving brightness of the light source module100-1.

The content of the diffusion material 41 may be properly adjusted so asto obtain light diffusion effects. In more detail, the content of thediffusion material 41 may be adjusted in the range of 0.01˜0.3% withrespect to the overall weight of the light guide layer 40, but thedisclosure is not limited thereto. The diffusion material 41 may includeone selected from the group consisting of silicon, silica, glassbubbles, PMMA, urethane, Zn, Zr, Al2O3 and acryl, and may have aparticle diameter of 1˜20 μm but the disclosure is not limited thereto.

In accordance with the first embodiment, the light source module 100-1may have a thin profile due to flexibility of the flexible printedcircuit board 10 and the light guide layer 40, and may be easily mountedon a bent housing, thus improving a degree of freedom in product design.

FIG. 3 illustrates a light source module 100-2 shown in FIG. 1 inaccordance with a second embodiment. Some parts in this embodiment whichare substantially the same as those in the first embodiment shown inFIG. 2 are denoted by the same reference numerals even though they aredepicted in different drawings, and redundant description of parts inthe above-mentioned description will be omitted or briefly given.

With reference to FIG. 3, the light source module 100-2 in accordancewith the second embodiment may further include a heat dissipation member110 in addition to the light source module 100-1 in accordance with thefirst embodiment so as to improve heat dissipation efficiency.

The heat dissipation member 110 is disposed on the lower surface of theflexible printed circuit board 10, and serves to dissipate heatgenerated from the light emitting devices 20 to the outside. That is,the heat dissipation member 110 may improve efficiency of dissipatingheat generated from the light emitting devices 20 which are lightsources, to the outside.

For example, the heat dissipation member 110 may be disposed at parts onthe lower surface of the flexible printed circuit board 10. The heatdissipation member 110 may include a plurality of heat dissipationlayers (for example, 110-1 and 110-2). In order to improve heatdissipation effects, the heat dissipation layers 110-1 and 110-2 maypartially overlap with the light emitting devices 20 in the verticaldirection. Here, the vertical direction may be a direction from theflexible printed circuit board 10 to the light guide layer 40.

The heat dissipation member 110 may be formed of a material having highthermal conductivity, for example, aluminum, an aluminum alloy, copperor a copper alloy. Further, the heat dissipation member 110 may be ametal core printed circuit board (MCPCB). The heat dissipation member110 may be attached to the lower surface of the flexible printed circuitboard 10 by an acryl-based adhesive (not shown).

In general, if the temperature of light emitting devices is increased byheat generated from the light emitting devices, brightness of the lightemitting devices may be reduced and shift of the wavelength of thegenerated heat may occur. Particularly, if the light emitting devicesare red light emitting diodes (LEDs), wavelength shift and brightnessreduction are severe.

However, the light source module 100-2 includes the heat dissipationmember 110 on the lower surface of the flexible printed circuit 10 toeffectively dissipate heat generated from the light emitting devices 20,thereby suppressing increase of the temperature of the light emittingdevices 20 and thus suppressing reduction of brightness and generationof wavelength shift.

FIG. 4 illustrates a light source module 100-3 shown in FIG. 1 inaccordance with a third embodiment. Some parts in this embodiment whichare substantially the same as those in the second embodiment shown inFIG. 3 are denoted by the same reference numerals even though they aredepicted in different drawings, and redundant description of parts inthe above-mentioned description will be omitted or briefly given.

With reference to FIG. 4, the light source module 100-3 in accordancewith the third embodiment may further include a reflective sheet 30,reflective patterns 31 and a first optical sheet 52 in addition to thelight source module 100-2 in accordance with the second embodiment.

The reflective sheet 30 is disposed between the flexible printed circuitboard 10 and the light guide layer 40, and may have a structure throughwhich the light emitting devices 20 pass. For example, the reflectivesheet 30 may be located at regions of the flexible printed circuit board10 except for regions where the light emitting devices 20 are located.

The reflective sheet 30 may be formed of a material having highreflection efficiency. The reflective sheet 30 reflects light irradiatedfrom the light emitting devices 20 to one surface (for example, theupper surface) of the light guide layer 40 and prevents the light fromleaking to the other surface (for example, the lower surface) of thelight guide layer 40, thereby reducing optical loss. Such a reflectivesheet 30 may be formed in a film type, and may include a synthetic resincontaining a white pigment which is diffused in the resin in order toimplement acceleration of light reflection and diffusion.

For example, titanium oxide, aluminum oxide, zinc oxide, lead carbonate,barium sulfate or calcium carbonate may be used as the white pigment,and polyethylene terephthalate, polyethylene naphtalate, an acrylicresin, polycarbonate, polystyrene, polyolefin, cellulose acetate orweather resistant vinyl chloride may be used as the synthetic resin, butthe disclosure is not limited thereto.

The reflective patterns 31 are disposed on the surface of the reflectivesheet 30, and may serve to scatter and disperse incident light. Thereflective patterns 31 may be formed by printing the surface of thereflective sheet 30 with reflective ink including one of TiO2, CaCO3,BaSO4, Al2O3, silicon and polystyrene (PS), but the disclosure is notlimited thereto.

Further, the reflective patterns 31 may be plural regular or irregularprotruding patterns. In order to increase light scattering effects, thereflective patterns 31 may have a prism shape, a lenticular shape, alens shape or a combinational shape thereof, but the disclosure is notlimited thereto. Further, in FIG. 4, the cross-section of the reflectivepatterns 31 may have various shapes, i.e., a polygonal shape, such as atriangular shape or a rectangular shape, a semicircular shape, a sinewave shape, etc., and the plane of the reflective patterns 31 seen fromthe top may have a polygonal shape (for example, a hexagonal shape), acircular shape, an oval shape or a semicircular shape.

FIG. 21 is a view illustrating the reflective patterns shown in FIG. 4in accordance with one embodiment. With reference to FIG. 21, thereflective patterns 31 may have different diameters according toseparation distances from the light emitting device 20.

For example, as the reflective patterns 31 are closer to the lightemitting device 20, the diameters of the reflective patterns 31 aregreater. In more detail, the diameters of the reflective patterns 31 maydecrease in order of a first reflective pattern 71, a second reflectivepattern 72, a third reflective pattern 73 and a fourth reflectivepattern 74. However, the disclosure is not limited thereto.

The first optical sheet 52 is disposed on the light guide layer 40, andtransmits light emitted from one surface (for example, the uppersurface) of the light guide layer 40. The first optical sheet 52 may beformed of a material having high light transmissivity, for example,polyethylene terephthalate (PET).

FIG. 5 illustrates a light source module 100-4 shown in FIG. 1 inaccordance with a fourth embodiment.

With reference to FIG. 5, the light source module 100-4 in accordancewith the fourth embodiment may further include an adhesive member 56,light shielding patterns 60, a second optical sheet 54 and a diffusionplate 70.

The second optical sheet 54 is disposed on the first optical sheet 52.The second optical sheet 54 may be formed of a material having highlight transmissivity, for example, PET.

The adhesive member 56 is disposed between the first optical sheet 52and the second optical sheet 54, and adheres the first optical sheet 52and the second optical sheet 54 to each other.

The optical patterns 60 may be disposed on at least one of the uppersurface of the first optical sheet 52 and the lower surface of thesecond optical sheet 54. The optical patterns 60 may be disposed on atleast one of the upper surface of the first optical sheet 52 and thelower surface of the second optical sheet 54 by the adhesive member 56.In accordance with another embodiment, the light source module 100-4 mayfurther include one or more optical sheets (not shown) on the secondoptical sheet 56. Here, a structure including the first optical sheet52, the second optical sheet 54, the adhesive member 56 and the opticalpatterns 60 may be defined as an optical pattern layer 50-1.

The optical patterns 60 may be light shielding patterns to prevent lightemitted from the light emitting devices 20 from being concentrated. Theoptical patterns 60 may be aligned with the light emitting devices 20,and may be adhered to the first optical sheet 52 and the second opticalsheet 54 by the adhesive member 56.

The first optical sheet 52 and the second optical sheet 54 may be formedof a material having high light transmissivity, for example, PET.

The optical patterns 60 basically function to prevent light emitted fromthe light emitting devices 20 from being concentrated. That is, theoptical patterns 60 together with the above-described reflectivepatterns 31 may achieve uniform surface light emission.

The optical patterns 60 may be light shielding patterns to shield a partof light emitted from the light emitting devices 20, and may preventdeterioration of optical characteristics or exposure of yellowish lightdue to an excessively high light intensity. For example, the opticalpatterns 60 may serve to prevent light from being concentrated onregions adjacent to the light emitting devices 20 and to disperse light.

The optical patterns 60 may be formed by performing a printing processon the upper surface of the first optical sheet 52 or the lower surfaceof the second optical sheet 54 using light shielding ink. The densityand/or size of the optical patterns 60 may be controlled to perform afunction of partially shielding light and a function of dispersinglight, other than to perform a function of completely shielding light,thereby adjusting a light shielding degree or a light dispersing degree.For example, in order to improve light efficiency, the optical patterns60 may be controlled such that the density of the optical patterns 60 ismore decreased as the optical patterns 60 is more distant from the lightemitting devices 20, but the disclosure is not limited thereto.

In more detail, the optical patterns 60 may be implemented as anoverlapping print structure of combinational patterns. The overlappingprint structure is a structure which is implemented by forming onepattern and printing another pattern thereon.

For example, the optical patterns 60 may have a structure in which adiffusion pattern and a light shielding pattern overlap. For example,the diffusion pattern may be formed on the lower surface of a polymerfilm (for example, the second optical sheet 54) in a light emittingdirection using light shielding ink including one or more materialsselected from the group consisting of TiO2, CaCO3, BaSO4, Al2O3 andsilicon. Further, the light shielding pattern may be formed on thepolymer film using light shielding ink including Al or a mixture of Aland TiO2.

That is, the diffusion pattern may be formed on the surface of thepolymer film through white printing and then the light shielding patternmay be formed thereon or vice versa may be possible so as to form adouble structure. Of course, it may be understood that the design ofthese patterns may be variously modified in consideration of lightefficiency, a light intensity and a light shielding rate.

Otherwise, in accordance with another embodiment, the optical patterns60 may have a triple structure including a first diffusion pattern, asecond diffusion pattern and a light shielding pattern disposedtherebetween. In such a triple structure, the above-described materialsmay be selected. For example, the first diffusion pattern may includeTiO2 having a high refractive index, the second diffusion pattern mayinclude both CaCO3 and TiO2 having excellent light stability and colorsense, and the light shielding pattern may include Al having a highconcealing function. This embodiment may obtain light efficiency anduniformity through the optical patterns having such a triple structure.Particularly, CaCO3 exerts a function of reducing exposure of yellowishlight to finally produce white light and thus to more stably producelight, and in addition to CaCO3, inorganic materials having a largeparticle size and a similar structure, such as BaSO4, Al2O3 and silicon,may be used as a diffusion material employed by the diffusion pattern.

The adhesive member 56 may surround the optical patterns 60, and may fixthe optical patterns 60 to the first optical sheet 52 and/or the secondoptical sheet 54. Here, the adhesive member 56 may use thermosettingPSA, a thermosetting adhesive, or a UV curable PSA type material, butthe disclosure is not limited thereto.

The diffusion plate 70 is disposed on the light guide layer 40. Thediffusion plate 70 may be disposed on the optical pattern layer 50-1,and may serve to uniformly diffuse light emitted via the light guidelayer 40 throughout the overall surface of the diffusion plate 70. Thediffusion plate 70 may be generally formed of acrylic resin, but thedisclosure is not limited thereto. That is, in addition to acrylicresin, the diffusion plate 70 may be formed of a material performing alight diffusion function, i.e., highly permeable plastic, such aspolystyrene (PS), polymethylmethacrylate (PMMA), cyclic olefin copolymer(COC), polyethylene terephthalate (PET) and resin.

An air gap 80 may be formed between the diffusion plate 70 and the lightguide layer 40. The air gap 80 may increase uniformity of light suppliedto the diffusion plate 70, and consequently increase uniformity of lightdiffused and emitted via the diffusion plate 70. Here, in order tominimize deviation of light transmitted by the light guide layer 40, thethickness of the first air gap 80 may be in the range of exceeding 0 mmand less than 20 mm, but the disclosure is not limited thereto. That is,the thickness of the first air gap 80 may be changed as needed. Althoughnot shown in the drawings, in accordance with another embodiment, one ormore optical sheets may be disposed on the optical pattern layer 50-1.

FIG. 6 illustrates a light source module 100-5 shown in FIG. 1 inaccordance with a fifth embodiment.

With reference to FIG. 6, the light source module 100-5 in accordancewith the fifth embodiment may further include a second air gap 81 inaddition to the light source module 100-4 in accordance with the fourthembodiment. That is, the light source module 100-5 in accordance withthe fifth embodiment may include the second air gap 81 between the firstoptical sheet 52 and the second optical sheet 54.

For example, the second air gap 81 may be formed on the adhesive member56. Separated spaces (the second air gap 81) are formed around theoptical patterns 60 of the adhesive member 56, and an adhesive materialis applied to the remaining regions to adhere the first optical sheet 52and the second optical sheet 54 to each other.

The adhesive member 56 may have a structure in which the second air gap81 is located around the peripheries of the optical patterns 60.Otherwise, the adhesive member 56 may have a structure in which theadhesive member 56 surrounds the peripheries of the optical patterns 60and the second air gap 81 is located around regions except for theperipheries of the optical patterns 60. The adhesive structure of thefirst optical sheet 52 and the second optical sheet 54 may also have afunction of fixing the printed optical patterns 60. A structureincluding the first optical sheet 52, the second optical sheet 54, thesecond air gap 82, the adhesive member 56 and the optical patterns 60may be defined as an optical pattern layer 50-2.

Since the second air gap 81 and the adhesive member 56 have differentrefractive indexes, the second air gap 81 may improve diffusion anddispersion of light traveling in a direction from the first opticalsheet 52 to the second optical sheet 54. Thereby, the light sourcemodule 100-5 in accordance with the fifth embodiment may implementuniform surface light emission.

FIG. 7 illustrates a light source module 100-6 shown in FIG. 1 inaccordance with a sixth embodiment.

With reference to FIG. 7, the light source module 100-6 in accordancewith the sixth embodiment may further include a light reflective member160 in addition to the light source module 100-5 in accordance with thefifth embodiment. The light reflective member 160 may be disposed at apart or the entirety of a side surface 40-1 of the light guide layer 40,and serve as a guide to prevent light emitted from the light emittingdevices 20 from being discharged to the outside through the side surface40-1 of the light guide layer 40.

The light reflective member 160 may be formed of a material having highlight reflectivity, for example a white resist. Further, the lightreflective member 160 may be formed of synthetic resin containing awhite pigment which is diffused in the resin or synthetic resincontaining metal particles having excellent light reflectingcharacteristics. Here, titanium oxide, aluminum oxide, zinc oxide, leadcarbonate, barium sulfate or calcium carbonate may be used as the whitepigment. If the light reflective member 160 includes metal powder, Agpowder having excellent reflectivity may be used. Further, the lightreflective member 160 may further include a fluorescent whitening agent.

The light reflective member 160 may be directly connected to the sidesurface 40-1 of the light guide layer 40 through molding, or may beadhered to the side surface 40-1 of the light guide layer 40 via aseparate adhesive material (or an adhesive tape).

The light source module 100-6 in accordance with the sixth embodimentmay prevent light from leaking to the side surface 40-1 of the lightguide layer 40 and thus reduce optical loss and increase lightefficiency, and may improve brightness and luminous intensity at thesame power. Although not shown in the drawings, a light source module inaccordance with another embodiment may further include the lightreflective member 160 on the side surface 40-1 of the light guide layer40 in addition to one of the light source modules 100-1 to 100-4 inaccordance with the first to fourth embodiments.

FIG. 8 illustrates a light source module 100-7 shown in FIG. 1 inaccordance with a seventh embodiment. With reference to FIG. 8, thelight source module 100-7 in accordance with the seventh embodiment mayfurther include via holes 212 and 214 to improve heat dissipation whichare provided on the flexible printed circuit board 10 in accordance withthe first embodiment.

The via holes 212 and 214 may pass through the flexible printed circuitboard 10, and exposure parts of the light emitting devices 20 or partsof the light guide layer 40. For example, the via holes 212 and 214 mayinclude first via holes 212 exposing parts of the light emitting devices20, and second via holes 214 exposing parts of the lower surface of thelight guide layer 40.

Heat generated from heat sources, i.e., the light emitting devices 20,may be discharged directly to the outside through the first via holes212, and heat conducted from the light emitting devices 20 to the lightguide layer 40 may be discharged directly to the outside through thesecond via holes 214. The light source module 100-7 in accordance withthe seventh embodiment discharges heat generated from the light emittingdevices 20 to the outside through the via holes 212 and 214, thusimproving heat dissipation efficiency. The first via holes 212 and thesecond via holes 214 may have various shapes, such as a polygonal shape,a circular shape, an oval shape, etc.

FIG. 9 illustrates a light source module 100-8 shown in FIG. 1 inaccordance with an eighth embodiment. With reference to FIG. 9, thelight source module 100-8 in accordance with the eighth embodiment mayfurther include a reflective sheet 30, reflective patterns 31 and afirst optical sheet 52 in addition to the light source module 100-7 inaccordance with the seventh embodiment. The light source module 100-8 inaccordance with the eighth embodiment may improve heat dissipationefficiency by means of the first and second via holes 212 and 214.Further, the added elements 30, 31 and 52 may be the same as thosedescribed with reference to FIG. 4.

FIG. 10 illustrates a light source module 100-9 shown in FIG. 1 inaccordance with a ninth embodiment. With reference to FIG. 10, the lightsource module 100-9 in accordance with the ninth embodiment may furtherinclude an adhesive member 56, light shielding patterns 60, a secondoptical sheet 54, and a diffusion plate 70 in addition to the lightsource module 100-8 in accordance with the eighth embodiment. The addedelements 54, 56 and 60 may be the same as those described with referenceto FIG. 5.

FIG. 11 illustrates a light source module 100-10 shown in FIG. 1 inaccordance with a tenth embodiment. With reference to FIG. 11, the lightsource module 100-10 in accordance with the tenth embodiment may furtherinclude an adhesive member 56, light shielding patterns 60, a secondoptical sheet 54, a diffusion plate 70, and a second air gap 81 inaddition to the light source module 100-8 in accordance with the eighthembodiment. The second air gap 81 may be formed between the firstoptical sheet 52 and the second optical sheet 54 of the light sourcemodule 100-10 in accordance with the tenth embodiment, and the secondair gap 81 may be the same as that described with reference to FIG. 6.

FIG. 12 illustrates a light source module 100-11 shown in FIG. 1 inaccordance with an eleventh embodiment. With reference to FIG. 12, thelight source module 100-11 in accordance with the eleventh embodimentmay further include a light reflective member 160 in addition to thelight source module 100-10 in accordance with the tenth embodiment. Thelight reflective member 160 may be disposed at a part or the entirety ofthe side surface 40-1 of the light guide layer 40. Although not shown inthe drawings, a light source module in accordance with anotherembodiment may further include a light reflective member 160 on the sidesurface 40-1 of the light guide layer 40 in addition to one of the lightsource modules 100-7 to 100-9 in accordance with the seventh to ninthembodiments.

FIG. 13 illustrates a light source module 100-12 shown in FIG. 1 inaccordance with a twelfth embodiment. Some parts in this embodimentwhich are substantially the same as those shown in FIG. 1 are denoted bythe same reference numerals even though they are depicted in differentdrawings, and redundant description of parts in the above-mentioneddescription will be omitted or briefly given.

With reference to FIG. 13, differently from the heat dissipation member110 of the light source module 100-1 in accordance with the firstembodiment, a heat dissipation member 310 of the light source module100-12 includes lower heat dissipation layers 310-1 disposed on thelower surface of the flexible printed circuit board 10, and throughparts 310-1 passing through the flexible printed circuit board 10 andcontacting the light emitting devices 20.

For example, the through parts 310-1 may contact a first side surfacepart 714 of a first lead frame 620 or 620′ of a light emitting devicepackage 200-1 or 200-2 which will be described later.

The light source module 100-12 in accordance with a twelfth embodimenttransmits heat generated from the light emitting devices 20 directly tothe heat dissipation member 310 by the through parts 310-1 anddischarges the heat to the outside, thus improving heat dissipationefficiency.

FIG. 14 illustrates a light source module 100-13 shown in FIG. 1 inaccordance with a thirteenth embodiment. With reference to FIG. 14, thelight source module 100-13 in accordance with the thirteenth embodimentmay further include a reflective sheet 30, reflective patterns 31 and afirst optical sheet 52 in addition to the light source module 100-12 inaccordance with the twelfth embodiment. The added elements 30, 31 and 52may be the same as those described with reference to FIG. 4.

FIG. 15 illustrates a light source module 100-14 shown in FIG. 1 inaccordance with a fourteenth embodiment. With reference to FIG. 15, thelight source module 100-14 in accordance with the fourteenth embodimentmay further include an adhesive member 56, light shielding patterns 60,a second optical sheet and 54, a diffusion plate 70 in addition to thelight source module 100-13 in accordance with the thirteenth embodiment.The added elements 54, 56, 60, and 70 may be the same as those describedwith reference to FIG. 5.

FIG. 16 illustrates a light source module 100-15 shown in FIG. 1 inaccordance with a fifteenth embodiment. With reference to FIG. 15, thelight source module 100-15 in accordance with the fifteenth embodimentmay further include a second air gap 81 in addition to the light sourcemodule 100-14 in accordance with the fourteenth embodiment. That is, thesecond air gap 81 may be formed between the first optical sheet 52 andthe second optical sheet 54 of the light source module 100-15 inaccordance with the fifteenth embodiment, and the second air gap 81 maybe the same as that described with reference to FIG. 6.

FIG. 17 illustrates a light source module 100-16 shown in FIG. 1 inaccordance with a sixteenth embodiment. With reference to FIG. 17, thelight source module 100-16 in accordance with the sixteenth embodimentmay further include a light reflective member 160 in addition to thelight source module 100-15 in accordance with the fifteenth embodiment.The light reflective member 160 may be disposed at a part or theentirety of the side surface 40-1 of the light guide layer 40. Althoughnot shown in the drawings, a light source module in accordance withanother embodiment may further include a light reflective member 160 onthe side surface 40-1 of the light guide layer 40 in addition to one ofthe light source modules 100-12 to 100-14 in accordance with the twelfthto fourteenth embodiments.

FIG. 18 illustrates a light source module 100-17 shown in FIG. 1 inaccordance with a seventeenth embodiment, FIG. 19 illustrates a lightsource module 100-18 shown in FIG. 1 in accordance with an eighteenthembodiment, and FIG. 20 illustrates a light source module 100-19 shownin FIG. 1 in accordance with a nineteenth embodiment.

A reflective sheet 30-1, a second optical sheet 54-1 and a diffusionplate 70-1 shown in FIGS. 18 to 20 may be modifications of thereflective sheet 30, the second optical sheet 54 and the diffusion plate70 shown in FIGS. 6, 11 and 16.

Unevennesses R1, R2 and R3 may be formed on one surface of at least oneof the reflective sheet 30-1, the second optical sheet 54-1 and thediffusion plate 70-1. The unevennesses R1, R2 and R3 serve to form ageometrical pattern of light discharged to the outside by reflecting anddiffusing incident light.

For example, a first unevenness R1 may be formed on one surface (forexample, the upper surface) of the reflective sheet 30-1, a secondunevenness R2 may be formed on one surface (for example, the uppersurface) of the second optical sheet 54-1, and a third unevenness R3 maybe formed on one surface (for example, the lower surface) of thediffusion plate 70-1. These unevennesses R1, R2 and R3 may be formed ina structure having a plurality of regular or irregular patterns, and inorder to increase light reflecting and diffusing effects, theunevennesses R1, R2 and R3 may have a prism shape, a lenticular shape, aconcave lens shape, a convex lens shape or a combinational shapethereof, but the disclosure is not limited thereto.

Further, the cross-sections of the unevennesses R1, R2 and R3 may havevarious shapes, such as a triangular shape, a rectangular shape, asemicircular shape, a sine wave shape, etc. Further, the sizes ordensities of respective patterns of the unevennesses R1, R2 and R3 maybe changed according to distances from the light emitting devices 20.

The unevennesses R1, R2 and R3 may be formed by directly processing thereflective sheet 54-1, the second optical sheet 54-1 and the diffusionplate 70-1, but the disclosure is not limited thereto. That is, theunevennesses R1, R2 and R3 may be formed in all methods which have beendeveloped up to now and commercialized, such as a method of adheringfilms provided with designated patterns, or all methods which will beimplemented according to future technical advances.

The light source modules 100-17, 100-18 and 100-19 in accordance withthese embodiments may easily form a geometrical optical pattern throughcombination of the patterns of the first to third unevennesses R1, R2and R3. In accordance with another embodiment, an unevenness may beformed on one surface or both surfaces of the first optical sheet 52.

However, the unevennesses R1, R2 and R3 are not limited to theembodiments of FIGS. 18 to 20, and an unevenness to increase lightreflecting and diffusing effects may be formed on one surface or bothsurfaces of at least one of the reflective sheet 54, the first opticalsheet 52, the second optical sheet 54 and the diffusion plate 70 inaccordance with other embodiments.

FIG. 22 illustrates a light source module 100-20 shown in FIG. 1 inaccordance with a twentieth embodiment. With reference to FIG. 22, thelight source module 100-20 in accordance with the twentieth embodimentincludes a surface light emission part 1000 and an indirect lightemission part 1001.

The surface light emission part 1000 converts light into surface lightand then discharges the surface light to the outside. Further, theindirect light emission part 1001 reflects light irradiated by thesurface light emission part 1000 to generate reflected light and thus toexert light leakage effects (or flare effects). Although FIG. 22exemplarily illustrates the indirect light emission part 1001 as beingformed on all side surfaces of the surface light emission part 1000, theindirect light emission part 1001 may be formed at least some of theside surfaces of the surface light emission part 1000.

The surface light emission part 1000 may be one of the light sourcemodules 100-1 to 100-5, 100-7 to 100-10, 100-12 to 100-15 and 100-17 to100-19 in accordance with the above-described embodiments.

The indirect light emission part 1001 may include a reflective member1100 disposed on the side surface of the surface light emission part1000. The reflective member 1100 may be separated from the surface lightemission part 1000, for example, the light guide layer 40 of the surfacelight emission part 1000, by a designated distance M.

A third air gap 83 may be formed between the surface light emission part1000 and the reflective member 1100. The reflective member 1100 reflectslight emitted from the side surface of the light guide layer 40 of thesurface light emission part 1000, thus generating reflected light (orindirect light). Therefore, flare effects in which light lost throughthe side surface of the light guide layer 40 is again reflected by thereflective member 1100 and is dimly spread occur, and variousillumination effects applicable to interior and exterior design andvehicle illumination may be obtained using such flare effects.

In order to maximize the flare effects, the third air gap 83 may beformed between the reflective member 1100 and the surface light emissionpart 1000. Thus, the air gap 83 scatters light emitted from the sidesurface of the light guide layer 40, and the scattered light is againreflected by the reflective member 1100, thereby maximizing the flareeffects. The material of the reflective member 1100 may be the same asthe material of the reflective member 160 shown in FIG. 7.

The height of the reflective member 1100 may be equal to the height ofone of the light guide layer 40, the first optical sheet 52, the secondoptical sheet 54 and the diffusion plate 70, but the disclosure is notlimited thereto.

Although FIG. 22 exemplarily illustrates the reflective member 1100 asbeing vertical to the horizontal surface of the surface light emissionpart 1000, for example, the upper surface of the light guide layer 40,the reflective member 1100 may be inclined at a designated angle withrespect to the horizontal surface of the surface light emission part1000 as needed.

The light source module 100-20 shown in FIG. 22 may further include asupport member 1200 surrounding the outer surfaces of the reflectivemember 1100 and the lower surface of the surface light emission part1000.

The support member 1200 supports and protects the surface light emissionpart 1000 and the reflective member 1100, thus improving durability andreliability. The material of the support member 1200 is not limited. Forexample, the support member 1200 may be formed of metal or be formed ofplastic. Further, the support member 1200 may be formed of a materialhaving designated flexibility.

FIG. 23 is a plan view illustrating a light source module 100-21 shownin FIG. 1 in accordance with a twenty first embodiment, FIG. 24 is across-sectional view of the light source module 100-21 shown in FIG. 23,taken along the line A-A′, FIG. 25 is a cross-sectional view of thelight source module 100-21 shown in FIG. 23, taken along the line B-B′,and FIG. 26 is a cross-sectional view of the light source module 100-21shown in FIG. 23, taken along the line C-C′.

With reference to FIGS. 23 to 26, the light source module 100-21includes a plurality of sub-light source modules 101-1 to 101-n (n beinga natural number >1), and the plural sub-light source modules 101-1 to101-n may be separated from each other and be combined with each other.Further, the combined plural sub-light source modules 101-1 to 101-n maybe electrically connected to each other.

Each of the sub-light source modules 101-1 to 101-n includes at leastone connector (for example, 510, 520 and 530) connectable to theoutside. For example, a first sub-light source module 101-1 may includea first connector 510 including at least one terminal (for example,terminals S1 and S2). A second sub-light source module 101-2 may includea first connector 520 and a second connector 530 respectively connectedto the outside, the first connector 520 may include at least oneterminal (for example, terminals P1 and P2), and the second connector530 may include at least one terminal (for example, terminals Q1 andQ2). Here, the first terminals S1, P1 and Q1 are positive (+) terminals,and the second terminals S2, P2 and Q2 are negative (−) terminals.Although FIG. 21 exemplarily illustrates the respective connectors (forexample, 510, 520 and 530) as including two terminals, the number ofterminals is not limited thereto.

FIGS. 24 to 26 illustrate a structure in which the connector 510, 520 or530 is added to the light source module 100-5 in accordance with thefifth embodiment, but the disclosure is not limited thereto. That is,each of the sub-light source modules 101-1 to 101-n may have a structurein which the connector (for example, 510, 520 or 530) and a couplingfixing part (for example, 410-1, 420-1 or 420-2) are added to one of thelight source modules 100-1 to 100-20 in accordance with theabove-described embodiments.

With reference to FIGS. 24 and 25, each of the sub-light source modules101-1 to 101-n includes the flexible printed circuit board 10, the lightemitting devices 20, the reflective sheet 30, the reflective patterns31, the light guide layer 40, the first optical sheet 52, the secondoptical sheet 54, the adhesive member 56, the optical patterns 60, thediffusion plate 70, the heat dissipation member 110, at least oneconnector 510, 520 or 530, and at least one coupling fixing part 410-1,420-1 or 420-2. Some parts in this embodiment which are substantiallythe same as those shown in FIG. 1 are denoted by the same referencenumerals even though they are depicted in different drawings, andredundant description of parts in the above-mentioned description willbe omitted or briefly given. As compared with the other embodiments, therespective sub-light source modules 101-1 to 101-n in accordance withthe twenty first embodiment may be different in terms of the size andthe number of the light emitting devices, but may have the sameconfiguration except for the connectors and the coupling fixing parts.

The first sub-light source module 101-1 may include the first connector510 electrically connected to the light emitting devices 20 and providedon the flexible printed circuit board 10 to be electrically connected tothe outside. For example, the first connector 510 may be formed in apatterned shape on the flexible printed circuit board 10.

Further, for example, the second sub-light source modules 101-2 mayinclude the first connector 520 and the second connector 530electrically connected to the light emitting devices 20. The firstconnector 520 may be provided at one side of the flexible printedcircuit board 10 to be electrically connected to the first connector 510of the first sub-light source module 101-1, and the second connector 530may be provided at the other side of the flexible printed circuit board10 to be electrically connected to another external light source module(for example, a connector (not shown) of the third sub-light sourcemodule).

The coupling fixing parts (for example, 410-1, 420-1 and 420-2 serve toconnect one sub-light source module to another external sub-light sourcemodule and to fix the two connected sub-light source modules to eachother. The coupling fixing parts (for example, 410-1, 420-1 and 420-2)may be protrusions protruding from parts of the side surface of thelight guide layer 40, or be depressions formed at parts of the sidesurface of the light guide layer 40.

With reference to FIG. 26, the first sub-light source module 101-1 mayinclude the first coupling fixing part 410-1 protruding from a part ofthe side surface of the light guide layer 40. Further, the secondsub-light source modules 101-2 may include the first coupling fixingpart 420-1 depressed into a part of the side surface of the light guidelayer 40 and the second coupling fixing part 420-2 protruding fromanother part of the side surface of the light guide layer 40.

The first coupling fixing part 410-1 of the first sub-light sourcemodule 101-1 and the second coupling fixing part 420-1 of the secondsub-light source module 101-2 may be fixed through male and female screwconnection.

Although this embodiment illustrates the coupling fixing parts (forexample, 410-1, 420-1 and 420-2) as being implemented as parts of thelight guide layer 40, the disclosure is not limited thereto. That is,separate coupling fixing parts may be provided, and the coupling fixingparts may be modified into other connectable shapes.

The sub-light source modules 101-1 to 101-n (n being a naturalnumber >1) may have a shape, a designated part of which protrudes, butthe disclosure is not limited thereto and the sub-light source modules101-1 to 101-n may be implemented as various shapes. For example, theplane of the sub-light source modules 101-1 to 101-n seen from the topmay be a circular shape, an oval shape or a polygonal shape, or a shape,a part of which protrudes in the sideward direction.

For example, one end of the first sub-light source module 101-1 mayinclude a protrusion 540 at the center thereof, the first connector 510may be provided on the flexible circuit board 10 at a portioncorresponding to the protrusion 540, and the first coupling fixing part410-1 may be provided on the light guide layer 40 at the remainingportion of the end of the first sub-light source module 101-1 except forthe protrusion 540.

Further, one end of the second sub-light source module 101-2 may includea depression 545 at the center thereof, the first connector 520 may beprovided on the flexible circuit board 10 at a portion corresponding tothe depression 545, and the first coupling fixing part 420-1 may beprovided on the light guide layer 40 at the remaining portion of the endof the second sub-light source module 101-2 except for the depression545. The other end of the second sub-light source module 101-2 mayinclude a protrusion 560 at the center thereof, the second connector 530may be provided on the flexible circuit board 10 at a portioncorresponding to the protrusion 560, and the second coupling fixing part420-2 may be provided on the light guide layer 40 at the remainingportion of the other end of the second sub-light source module 101-2except for the protrusion 560.

The sub-light source modules 101-1 to 101-n may respectively serve asindependent light sources, the shape of the sub-light source modules101-1 to 101-n may be variously modified, and two or more sub-lightsource modules may be assembled by the coupling fixing parts and maythus be used as an independent light source. Therefore, this embodimentmay improve a degree of freedom of product design. Further, thisembodiment, if some of the assembled sub-light source modules aredamaged or broken, may allow only the damaged sub-light source modulesto be replaced with new ones.

The above-described light source modules may be used in a displaydevice, an indicator device and a lighting system requiring surfacelight sources. Particularly, the light source modules in accordance withthe embodiments may be easily mounted at a place (for example, a ceilingor a floor having a bent part) which requires illumination but isprovided with a bent part on which the illumination is mounted, and thuswhere it is not easy to install the illumination. For example, thelighting system may include a lamp or a streetlamp, and the lamp may bea head lamp for vehicles but the disclosure is not limited thereto.

FIG. 27 is a perspective view illustrating a head lamp 900-1 forvehicles in accordance with one embodiment, and FIG. 49 is a perspectiveview illustrating a general head lamp for vehicles which is a pointlight source. With reference to FIG. 27, the head lamp 900-1 forvehicles includes a light source module 910 and a light housing 920.

The light source module 910 may be one of the light source modules 100-1to 100-21 in accordance with the above-described embodiments. The lighthousing 920 may accommodate the light source module 910 and be formed ofa light transmitting material. The light housing 920 for vehicles mayinclude a bent part according to vehicle regions on which the lighthousing 920 is mounted and vehicle designs. Since the light sourcemodule 910 uses the flexible circuit board 10 and the light guide layer40 and thus has flexibility, the light source module 910 may be easilymounted on the light housing 920 for vehicles having the bent part.Further, since the light source modules 100-1 to 100-21 have a structurewith improved heat dissipation efficiency, the head lamp 900-1 forvehicles in accordance with this embodiment may prevent generation ofwavelength shift and brightness reduction.

The general head lamp for vehicles shown in FIG. 49 is a point lightsource, and thus may generate partial spots on a light emission surfaceduring emission of light. However, the head lamp 900-1 for vehicles inaccordance with this embodiment is a surface light source, and thus doesnot generate spots but may achieve uniform brightness and luminousintensity throughout a light emission surface.

FIG. 28 is a perspective view of a light emitting device package 200-1in accordance with a first embodiment, FIG. 29 is a top view of thelight emitting device package 200-1 in accordance with the firstembodiment, FIG. 30 is a front view of the light emitting device package200-1 in accordance with the first embodiment, and FIG. 31 is a sideview of the light emitting device package 200-1 in accordance with thefirst embodiment.

The light emitting device package 200-1 shown in FIG. 28 may be a lightemitting device package included in one of the light source modules100-1 to 100-21 in accordance with the above-described embodiments, butthe disclosure is not limited thereto.

With reference to FIGS. 28 to 31, the light emitting device package200-1 includes a package body 610, a first lead frame 620, a second leadframe 630, light emitting chips 640, a Zener diode 645 and wires 650-1.

The package body 610 may be formed of a substrate having high insulationand thermal conductivity, such as a silicon-based wafer level package, asilicon substrate, a silicon carbide (SiC) substrate or a aluminumnitride (AlN) substrate, and may have a structure in which a pluralityof substrates is stacked. However, the disclosure is not limited to theabove-described material, structure and shape of the package body 610.

For example, the length X1 of the package body 610 in a first direction(for example, in the X-axis direction) may be 5.95 mm˜6.05 mm, and thelength Y1 of the package body 610 in a second direction (for example, inthe Y-axis direction) may be 1.35 mm˜1.45 mm. The length Y2 of thepackage body 610 in a third direction (for example, in the Z-axisdirection) may be 1.6 mm˜1.7 mm. For example, the first direction may bea direction in parallel with the long side of the package body 610.

The package body 610 may include a cavity 601 provided with an openedupper portion and including a side wall 602 and a bottom 603. The cavity601 may be formed in a cup shape and a concave container shape, and theside wall 602 of the cavity 601 may be vertical to or inclined withrespect to the bottom 603. The shape of the cavity 601 seen from the topmay be a circle, an oval or a polygon (for example, a rectangle). Thecorners of the polygonal cavity 601 may be curved. For example, thelength X3 of the cavity 601 in the first direction (for example, in theX-axis direction) may be 4.15 mm˜4.25 mm, the length X4 of the cavity601 in the second direction (for example, in the Y-axis direction) maybe 0.64 mm˜0.9 mm, and the depth Y3 of the cavity 601 (for example, thelength of the cavity 601 in the Z-axis direction) may be 0.33 mm˜0.53mm.

The first lead frame 620 and the second lead frame 630 may be disposedon the surface of the package body 610 such that the first and secondlead frames 620 and 630 are electrically isolated from each other inconsideration of heat discharge or mounting of the light emitting chips640. The light emitting chips 640 are electrically connected to thefirst lead frame 620 and the second lead frame 630. The number of thelight emitting chips 640 may be 1 or more.

A reflective member (not shown) reflecting light emitted from the lightemitting chips 640 in a designated direction may be provided on the sidewall 602 of the cavity 601 of the package body 610.

The first lead frame 620 and the second lead frame 630 may be separatedfrom each other within the upper surface of the package body 610. A partof the package body 610 (for example, the bottom 603 of the cavity 601)is located between the first lead frame 620 and the second lead frame630, and may thus electrically separate the first lead frame 620 and thesecond lead frame 630 from each other.

The first lead frame 620 may include one end (for example 712) exposedto the cavity 601 and the other end (for example 714) passing throughthe package body 610 and exposed to one surface of the package body 610.Further, the second lead frame 630 may include one end (for example,744-1) exposed to one side of one surface of the package body 610, theother end (for example, 744-2) exposed to the other side of the surfaceof the package body 610, and an intermediate part 742-2 exposed to thecavity 601.

A separation distance X2 between the first lead frame 620 and the secondlead frame 630 may be 0.1 mm˜0.2 mm. The upper surface of the first leadframe 620 and the upper surface of the second lead frame 630 may becoplanar with the bottom 603 of the cavity 601.

FIG. 32 is a perspective view illustrating the first lead frame 620 andthe second lead frame 630 shown in FIG. 28, FIG. 33 is a cross-sectionalview illustrating the sizes of respective parts of the first lead frame620 and the second lead frame 630 shown in FIG. 32, and FIG. 34 is anenlarged view illustrating connection parts 732, 734 and 736 of thefirst lead frame 620 adjacent to a boundary part 801 between a firstupper surface part 712 and a first side surface part 714 shown in FIG.33.

With reference to FIGS. 32 to 34, the first lead frame 620 includes thefirst upper surface part 712 and the second side surface part 714 bentfrom a first side portion of the first upper surface part 712.

The first upper surface part 712 may be coplanar with the bottom 603 ofthe cavity 601 and be exposed by the cavity 601, and light emittingchips 642 and 644 may be disposed on the first upper surface part 712.

As shown in FIG. 33, both ends of the first upper surface part 712 mayinclude a protrusion S3 protruding in the first direction (in the X-axisdirection) with respect to the first side surface part 714. Theprotrusions S3 of the first upper surface part 712 may support the firstlead frame of a lead frame array. The length of the protrusions S3 ofthe first upper surface part 712 in the first direction may be 0.4mm˜0.5 mm. The length K of the first upper surface part 712 in the firstdirection may be 3.45 mm˜3.55 mm, and the length J1 of the first uppersurface part 712 in the second direction may be 0.6 mm˜0.7 mm. The firstdirection may be the X-axis direction and the second direction may bethe Y-axis direction in the XYZ coordinate system.

A second side portion of the first upper surface part 712 may include atleast one depression 701. Here, the second side portion of the firstupper surface part 712 may be opposite the first side portion of thefirst upper surface part 712. For example, although the second sideportion of the first upper surface part 712 may include one depression701 at the center thereof, the disclosure is not limited thereto and thenumber of depressions formed on the side surface portion may be 2 ormore. The depression 701 may have a shape corresponding to a protrusion702 provided on the second lead frame 630 which will be described later.

Although the depression 701 shown in FIG. 33 has a trapezoidal shape,the disclosure is not limited thereto and the depression 701 may havevarious shapes, such as a circular shape, a polygonal shape, an ovalshape, etc. The length S2 of the depression 701 in the first directionmay be 1.15 mm˜1.25 mm, and the length S1 of the depression 701 in thesecond direction may be 0.4 mm˜0.5 mm.

The angle δ1 formed by a bottom 701-1 and a side surface 701-2 of thedepression 701 may be 90° or more and be smaller than 180°. The lightemitting chips 642 and 633 may be disposed on the first upper surfacepart 712 at both sides of the depression 701.

The first side surface part 714 may be bent downwardly from the firstside portion of the first upper surface part 712 at a designated angle,and may be exposed from one side surface of the package body 610. Forexample, the angle formed by the first upper surface part 712 and thefirst side surface part 714 may be 90° or more and be smaller than 180°.

The first lead frame 620 may include one or more through holes 720 on atleast one of the first upper surface part 712 and the first side surfacepart 714. For example, the first lead frame 620 may include one or morethrough holes 720 adjacent to the boundary part between the first uppersurface part 712 and the first side surface part 714. Although FIG. 32illustrates two through holes 722 and 724 separated from each other asbeing located at the boundary part between the first upper surface part712 and the first side surface part 714, the disclosure is not limitedthereto.

The one or more through holes 720 may be formed at one region of each ofthe first upper surface part 712 and the first side surface part 714adjacent to the boundary part between the first upper surface part 712and the first side surface part 714. Here, a through hole 722-1 formedat one region of the first upper surface part 712 and a through hole722-2 formed at one region of the first side surface part 714 may beconnected.

The through holes 720 may serve to improve coupling between the firstlead frame 620 and the package body 610 by filling a portion of thepackage body 610 within the through holes 720. Further, the throughholes 720 may serve to easily form a bent part between the first uppersurface part 712 and the first side surface part 714. However, if thesize of the through holes 720 is excessively large or the number of thethrough holes 720 is excessively large, the first upper surface part 712and the first side surface part 714 may be cut off when the first leadframe 620 is bent, and thus the size and number of the through holes 720need to be properly adjusted. Further, the size of the through holes 720relates to the size of the connection parts 732, 734 and 736 which willbe described later, and thus relates to heat dissipation of the lightemitting device package.

The embodiment illustrating the sizes of the first lead frame 620 havingthrough holes and the second lead frame 630 which will be describedhereinafter, may exert the optimum heat dissipation efficiency inconsideration of a coupling degree with the package body 610 and ease ofbending.

In order to improve the coupling degree with the package body 610, tofacilitate bending of the first lead frame 620 and to prevent damage tothe first lead frame 620 during bending of the first lead frame 620, thelight emitting device package in accordance with this embodiment mayinclude the first through hole 722 and the second through hole 724, thelength D11 of the first through hole 722 in the first direction and thelength D12 of the second through hole 724 in the first direction may be0.58 mm˜0.68 mm, and the length D2 of the first and second through holes722 and 724 in the second direction may be 0.19 mm˜0.29 mm. The area ofthe first through hole 722 may be equal to the area of the secondthrough hole 724, but the disclosure is not limited thereto and theareas of the first and second through holes 722 and 724 may bedifferent.

With reference to FIG. 34, the first lead frame 620 may include theconnection parts 732, 734 and 736 located adjacent to the boundary part801 between the first upper surface part 712 and the first side surfacepart 714, separated from each other by the through holes 720, andconnecting the first upper surface part 712 and the first side surfacepart 714. For example, the connection parts 732, 734 and 736 mayrespectively include first parts 732-1, 734-1, 736-1 corresponding toportions of the first upper surface part 712, and second parts 732-2,734-2, 736-2 corresponding to portions of the first side surface part714. The through holes 720 may be located between the respectiveconnection parts 732, 734 and 736.

The first lead frame 620 may include at least one connection partcorresponding to or be aligned with the light emitting chip 642 or 644.

In more detail, the first lead frames may include first to thirdconnection parts 732, 734 and 736. The first connection part 732 may belocated to correspond to or be aligned with the first light emittingchip 642, and the second connection part 734 may be located tocorrespond to or be aligned with the second light emitting chip 644. Thethird connection part 736 may be located between the first connectionpart 732 and the second connection part 734, and are not aligned withthe first light emitting chip 642 and the second light emitting chip644. For example, the third connection part 736 may be located tocorrespond to or be aligned with the depression 701 of the first leadframe 620, but the disclosure is not limited thereto.

The length C11 of the first connection part 732 in the first directionand the length C2 of the second connection part 734 in the firstdirection may be greater than the length E of the third connection part736 in the first direction. For example, the length C11 of the firstconnection part 732 in the first direction and the length C2 of thesecond connection part 734 in the first direction may be 0.45 mm˜0.55mm, and the length E of the third connection part 736 in the firstdirection may be 0.3 mm˜0.4 mm. The reason for location of the thirdconnection part 736 between the first through hole 722 and the secondthrough hole 724 is to prevent cut between the first upper surface part712 and the first side surface part 714 during bending of the first leadframe 620.

The ratio of the length E of the third connection part 736 in the firstdirection to the length C11 of the first connection part 732 in thefirst direction may be 1:1.2˜1.8. The ratio of the length D11 or D12 ofthe first or second through hole 722 or 724 to the length B1 of an upperend 714-1 of the first side surface part 714 may be 1:3.8.

Since the first connection part 732 is aligned with the first lightemitting chip 642 and the second connection part 734 is aligned with thesecond light emitting chip 644, heat generated from the first lightemitting chip 642 may be discharged to the outside mainly through thefirst connection part 732 and heat generated from the second lightemitting chip 644 may be discharged to the outside mainly through thesecond connection part 734.

In this embodiment, since the lengths C11 and C2 of the first connectionpart 732 and the second connection part 734 in the first direction aregreater than the length E of the third connection part 736 in the firstdirection, the areas of the first connection part 732 and the secondconnection part 734 are greater than the area of the third connectionpart 736. Therefore, the light emitting device package in accordancewith this embodiment may improve efficiency of discharging heatgenerated from the first light emitting chip 642 and the second lightemitting chip 644 by increasing the areas of the connection parts 732and 734 adjacent to the light emitting devices 20.

The first side surface part 714 may be divided into the upper end 714-1connected to the first upper surface part 712 and a lower end 714-2connected to the upper end 714-1. That is, the upper end 714-1 mayinclude portions of the first to third connection parts 732, 734 and736, and the lower end 714-2 may be located under the upper end 714-1.

The length F1 of the upper end 714-1 in the third direction may be 0.6mm˜0.7 mm, and the length F2 of the lower end 714-2 in the thirddirection may be 0.4 mm˜0.5 mm. The third direction may be the Z-axisdirection in the XYZ coordinate system.

In order to improve coupling with the package body 610 and air tightnessto block moisture, the side surface of the upper end 714-1 and the sidesurface of the lower end 714-2 may be stepped. For example, both sideends of the lower end 714-2 may protrude in the sideward direction withrespect to the side surface of the upper end 714-1. The length B1 of theupper end 714-1 in the first direction may be 2.56 mm˜2.66 mm, and thelength B2 of the lower end 714-2 in the first direction may be 2.7mm˜3.7 mm. The thickness t1 of the first lead frame 620 may be 0.1mm˜0.2 mm.

The second lead frame 630 may be disposed to surround at least one sideportion of the first lead frame 620. For example, the second lead frame620 may be disposed around remaining side portions except for the firstside surface part 714 of the first lead frame 630.

The second lead frame 630 may include a second upper surface part 742and a second side surface part 744. The second upper surface part 742may be disposed to surround remaining side portions except for a firstside portion of the first upper surface part 712. As shown in FIGS. 28and 32, the second upper surface part 742 may be coplanar with thebottom 603 of the cavity 601 and the first upper surface part 712, andbe exposed by the cavity 601. The thickness t2 of the second lead frame630 may be 0.1 mm˜0.2 mm.

The second upper surface part 742 may be divided into a first portion742-1, a second portion 742-2 and a third portion 742-3 according topositions surrounding the first upper surface part 712. The secondportion 742-2 of the second upper surface part 742 may correspond to orbe opposite the second side portion of the first upper surface part 712.The first portion 742-1 of the second upper surface part 742 may beconnected to one end of the second portion 742-2, and may correspond toor be opposite to one of the remaining side portions of the first uppersurface part 712. The third portion 742-3 of the second upper surfacepart 742 may be connected to the other end of the second portion 742-2,and may correspond to or be opposite to another of the remaining sideportions of the first upper surface part 712.

The length H1 of the first portion 742-1 and the third portion 742-3 inthe second direction may be 0.65 mm˜0.75 mm, and the length H2 of thefirst portion 742-1 and the third portion 742-3 in the first directionmay be 0.78 mm˜0.88 mm. The length I of the second portion 742-2 in thefirst direction may be 4.8 mm˜4.9 mm.

The second portion 742-2 of the second upper surface part 742 mayinclude the protrusion 702 corresponding to the depression 701 of thefirst upper surface part 712. For example, the shape of the protrusion702 may match the shape of the depression 701, and the protrusion 702may be located to be aligned with the depression 701. The protrusion 702may be located within the depression 701. The number of protrusions 702may be equal to the number of depressions 701. The protrusion 702 andthe depression 701 may be separated from each other, and a portion ofthe package body 610 may be located therebetween. The protrusion 702 isan area for wire bonding with the first light emitting chip 642 and thesecond light emitting chip 644, and is located between the first lightemitting chip 642 and the second light emitting chip 644, thusfacilitating wire bonding with the first light emitting chip 642 and thesecond light emitting chip 644.

The length S5 of the protrusion 702 in the first direction may be 0.85mm˜0.95 mm, the length S4 of the protrusion 702 in the second directionmay be 0.3 mm˜0.4 mm, and the angle θ2 formed by the protrusion 702 andthe second portion 742-2 may be 90° or more and be smaller than 180°.

The second side surface part 744 may be bent from at least one sideportion of the second upper surface part 742. The second side surfacepart 744 may be bent downwardly from the second upper surface part 742at a designated angle (for example, 90°).

For example, the second side surface part 744 may include a firstportion 744-1 bent from one side portion of the first portion 742-1 ofthe second upper surface part 742 and a second portion 744-2 bent fromone side portion of the third portion 742-3 of the second upper surfacepart 742.

The first portion 744-1 and the second portion 744-2 of the second sidesurface part 744 may be bent to be located on the same side surface ofthe second lead frame 630. The first portion 744-1 of the second sidesurface part 744 may be separated from the first side surface part 714,and may be located at one side (for example, the left side) of the firstside surface part 714. The second portion 744-2 of the second sidesurface part 744 may be separated from the first side surface part 714,and may be located at the other side (for example, the right side) ofthe first side surface part 714. The first side surface part 714 and thesecond side surface part 744 may be coplanar with each other.Consequently, as shown in FIG. 28, the first side surface part 714 andthe second side surface part 744 may be exposed to the same side surfaceof the package body 610. The length A of the second side surface part744 in the first direction may be 0.4 mm˜0.5 mm, and the length G of thesecond side surface part 744 in the third direction may be 1.05 mm˜1.15mm.

One side surface of each of the first portion 742-1 and the thirdportion 742-3 of the second upper surface part 742 may have a steppedportion g1. For example, the stepped portion g1 may be located adjacentto a region where one side surface of the first portion 742-1 of thesecond upper surface part 742 and one side surface of the first portion744-1 of the second side surface part 744 meet. Since the area of thefirst upper surface part 712 and the first side surface part 714 may beincreased by the stepped portions g1, the light emitting device packagein accordance with this embodiment may increase a heat dissipation areaand thus improve heat dissipation efficiency. Because the area of thefirst lead frame 620 relates to discharge of heat generated from thelight emitting chips 642 and 644.

The other side surface of each of the first portion 742-1 and the thirdportion 742-3 of the second upper surface part 742 may have a steppedportion g2. The reason for formation of the stepped portions g2 is toallow a bonding material (for example, solder) to be easily observedwith the naked eye when the light emitting device package 200-1 isbonded to the flexible printed circuit board 10.

The first side surface part 714 of the first lead frame 620 and thesecond side surface part 744 of the second lead frame 630 may be mountedon and contact the flexible printed circuit board 10 of each of thelight source modules 100-1 to 100-21 in accordance with the embodiments,and thereby, the light emitting chips 640 may irradiate light in adirection 3 toward the side surface of the light guide layer 40. Thatis, the light emitting device package 200-1 may have a side view typestructure.

The Zener diode 645 may be disposed on the second lead frame 630 toimprove withstand voltage of the light emitting device package 200-1.For example, the Zener diode 645 may be disposed on the second uppersurface part 742 of the second lead frame 630.

The first light emitting chip 642 may be electrically connected to thesecond lead frame 630 by a first wire 652, the second light emittingchip 644 may be electrically connected to the second lead frame 630 by asecond wire 654, and the Zener diode 645 may be electrically connectedto the first lead frame 620 by a third wire 656.

For example, one end of the first wire 652 may be connected to the firstlight emitting chip 642, and the other end of the first wire 652 may beconnected to the protrusion 702. Further, one end of the second wire 654may be connected to the second light emitting chip 644, and the otherend of the second wire 654 may be connected to the protrusion 702.

The light emitting device package 200-1 may further include a resinlayer (not shown) filling the inside of the cavity 601 to surround thelight emitting chips 640. The resin layer may be formed of a colorlesstransparent polymer resin material, such as epoxy or silicon.

The light emitting device package 200-1 may produce red light using onlyred light emitting chips without a phosphor, but the disclosure is notlimited thereto. The resin layer may include a phosphor so as to changethe wavelength of light emitted from the light emitting chips 640. Forexample, although light emitting chips emitting colored light other thanred light are used, a light emitting device package emitting desiredcolored light by changing the wavelength of light using a phosphor maybe implemented.

FIG. 35 illustrates a first lead frame 620-1 and a second lead frame 630in accordance with another embodiment. Some parts in this embodimentwhich are substantially the same as those shown in FIG. 32 are denotedby the same reference numerals even though they are depicted indifferent drawings, and redundant description of parts in theabove-mentioned description will be omitted or briefly given.

With reference to FIG. 35, the first lead frame 620-1 has a structure inwhich the third connection part 736 is removed from the first lead frame620 shown in FIG. 32. That is, the first lead frame 620-1 may includeone through hole 720-1 adjacent to a boundary part between a first uppersurface part 712 and a first side surface part 714′. A first connectionpart 732 may be located at one side of the through hole 720-1, and asecond connection part 734 may be located at the other side of thethrough hole 720-1.

FIG. 36 illustrates a first lead frame 620-2 and a second lead frame630-1 in accordance with another embodiment. Some parts in thisembodiment which are substantially the same as those shown in FIG. 32are denoted by the same reference numerals even though they are depictedin different drawings, and redundant description of parts in theabove-mentioned description will be omitted or briefly given.

With reference to FIG. 36, a first upper surface part 712′ of the firstlead frame 620-1 may have a structure in which the depression 701 isomitted from the first upper surface part 712 of the first lead frame620 shown in FIG. 32. Further, a second portion 742-2′ of a second uppersurface part 742′ of the second lead frame 630-1 may have a structure inwhich the protrusion 702 is omitted from the second portion 742-2 of thesecond upper surface part 742 of the second lead frame 630 shown in FIG.32. Other elements in accordance with this embodiment may be the same asthose shown in FIG. 32.

FIG. 37 illustrates a first lead frame 620-3 and a second lead frame 630in accordance with another embodiment. Some parts in this embodimentwhich are substantially the same as those shown in FIG. 32 are denotedby the same reference numerals even though they are depicted indifferent drawings, and redundant description of parts in theabove-mentioned description will be omitted or briefly given.

With reference to FIG. 37, the first lead frame 620-3 may have astructure in which fine through holes h1, h2 and h3 passing through thefirst lead frame 620 are formed on at least one of the connection parts732, 734 and 736 of the first lead frame 620 shown in FIG. 32.

At least one of connection parts 732-1, 734-1 and 736-1 of the firstlead frame 620-3 may include the fine through holes h1, h2 and h3 formedat a boundary part between a first upper surface part 712 and a firstside surface part 714. Here, the diameter of the fine through holes h1,h2 and h3 may be smaller than the length D11 or D12 of through holes 722and 724 in the first direction or the length D2 of the through hole 722and 724 in the second direction. The number of the fine through holes h1and h2 formed at the first connection part 732-1 and the secondconnection part 734-1 may be greater than the number of the fine throughholes h3 formed at the third connection part 736-1, but the disclosureis not limited thereto. Further, the fine through holes h1, h2 and h3may have a circular shape, an oval shape or a polygonal shape. The finethrough holes h1, h2 and h3 may improve coupling force between the firstlead frame 620-3 and the package body 610 as well as facilitate bendingof the first lead frame 620-3.

FIG. 38 illustrates a first lead frame 620-4 and a second lead frame 630in accordance with another embodiment. Some parts in this embodimentwhich are substantially the same as those shown in FIG. 32 are denotedby the same reference numerals even though they are depicted indifferent drawings, and redundant description of parts in theabove-mentioned description will be omitted or briefly given.

With reference to FIG. 38, the first lead frame 620-4 includes a firstupper surface part 712″ and a first side surface part 714″. The firstupper surface part 712″ and the first side surface part 714″ aremodifications of the first upper surface part 712 and the first sidesurface part 714 shown in FIG. 32. That is, the first lead frame 620-4has a structure in which the through holes 722 and 724 are omitted fromthe first upper surface part 712 and the first side surface part 714 ofthe first lead frame 620 shown in FIG. 32 and a plurality of finethrough holes h4 separated from each other is formed at one region Q2 ofa boundary part Q between the first upper surface part 721″ and thefirst side surface part 714″.

The boundary part Q between the first upper surface part 721″ and thefirst side surface part 714″ may be divided into a first boundary regionQ1, a second boundary region Q2 and a third boundary region Q3. Thefirst boundary region may correspond to or be aligned with the firstlight emitting chip 642, the third boundary region Q3 may correspond toor be aligned with the second light emitting chip 644, and the secondboundary region Q2 may be located between the first boundary region Q1and the third boundary region Q3.

The first boundary region Q1 and the third boundary region Q3 may serveas paths transmitting light generated from the first light emitting chip642 and the second light emitting chip 644, and the plural fine throughholes h4 may serve to facilitate bending between the first upper surfacepart 712″ and the first side surface part 714″. Although FIG. 38illustrates the plural fine through holes h4 as having the same diameterand separation distance, the disclosure is not limited thereto. That is,in accordance with other embodiments, at least one of the plural finethrough holes h4 may have a different diameter, or separation distancesbetween the plural fine through holes h4 may be different.

FIG. 39 illustrates a first lead frame 620 and a second lead frame 630-2in accordance with another embodiment. The second lead frame 630-2 shownin FIG. 39 may be a modification of the second lead frame 630 shown inFIG. 32. Some parts in this embodiment which are substantially the sameas those shown in FIG. 32 are denoted by the same reference numeralseven though they are depicted in different drawings, and redundantdescription of parts in the above-mentioned description will be omittedor briefly given.

With reference to FIG. 39, differently from the second portion 742-2 ofthe second upper surface part 742 shown in FIG. 32, a second portion742-2″ of a second upper surface part 742″ shown in FIG. 39 has a cutstructure, and does not connect a first portion 742-1 and a thirdportion 742-3.

The second upper surface part 742″ of the second lead frame 630-2 mayinclude the first portion 742-1, the second portion 742-2″ and the thirdportion 742-3. The first portion 742-1, the second portion 742-2″ andthe third portion 742-3 may be located around a corresponding one ofside portions of the first upper surface part 712 of the first leadframe 620.

The second portion 742-2″ of the second upper surface part 742″ mayinclude a first region 704 connected to the first portion 742-1 and asecond region 705 connected to the third portion 742-3 and separatedfrom the first region 704. Since a separation space 706 between thefirst region 704 and the second region 705 is filled with the packagebody 610, coupling force between the package body 610 and the secondlead frame 630-2 may be improved. The second lead frame 630-2 shown inFIG. 39 may be divided into a first sub-frame 744-1, 742-2 and 704 and asecond sub-frame 744-2, 742-3 and 705 which may be electrically isolatedfrom each other.

FIG. 40 illustrates a first lead frame 810 and a second lead frame 820in accordance with another embodiment.

With reference to FIG. 40, the first lead frame 810 may include a firstupper surface part 812, and a first side surface part 814 and a secondside surface part 816 bent from a first side portion of the first uppersurface part 812. Light emitting chips 642 and 644 may be disposed onthe first upper surface part 812.

A second side portion of the first upper surface part 812 may includeone or more first depressions 803 and 804 and a first protrusion 805.Here, the second side portion of the first upper surface part 812 may beopposite the first side portion of the first upper surface part 812. Forexample, the second side portion of the first upper surface part 812 mayinclude two first depressions 803 and 804 and one first protrusion 805located between the first depressions 803 and 804, but the disclosure isnot limited thereto. The first depressions 803 and 804 may have a shapecorresponding to second protrusions 813 and 814 provided on the secondlead frame 820 which will be described later, and the first protrusion805 may have a shape corresponding to a second depression 815 providedon the second lead frame 820. Although the first depressions 803 and 804and the first protrusion 805 shown in FIG. 40 have a rectangular shape,the disclosure is not limited thereto and the first depressions 803 and804 and the first protrusion 805 may have various shapes, such as acircular shape, a polygonal shape, an oval shape, etc. The lightemitting chips 642 and 644 may be disposed on the first upper surfacepart 812 at both sides of the first depressions 803 and 804.

The first side surface part 814 may be connected to one region of thefirst side portion of the first side surface part 712, the second sidesurface part 816 may be connected to another region of the first sideportion of the first side surface part 712, and the first side surfacepart 814 and the second side surface part 816 may be separated from eachother. The first side surface part 814 and the second side surface part816 may be exposed from one side surface of the package body 610.

The first lead frame 610 may include one or more through holes 840formed on at least one of the first upper surface part 812 and the firstside surface part 814. For example, the first lead frame 610 may includeone or more through holes 840 formed adjacent to a boundary part betweenthe first upper surface part 812 and the first side surface part 814.The through holes 840 may have the same structure and function as thethrough holes 720 shown in FIGS. 32 and 34.

The first lead frame 810 may include connection parts 852, 854 and 856located adjacent to the boundary part between the first upper surfacepart 812 and the first side surface part 814, separated from each otherby the through holes 840, and connecting the first upper surface part812 and the first side surface part 814. The structure and function ofthe connection parts 852, 854 and 856 may be the same as those of thethrough holes 720 shown in FIGS. 32 and 34. The first lead frame 810 mayinclude at least one connection part corresponding to or locatedadjacent to the light emitting chip 642 or 644.

The length of the connection parts (for example, 852 and 854)corresponding to or located adjacent to the light emitting chips 642 and644 in the first direction may be greater than the length of theconnection part (for example, 856) not corresponding to or not locatedadjacent to the light emitting chips 642 and 644 in the first direction.

In order to improve coupling with the package body 610 and air tightnessto block moisture, the lower portion of the side surface of the secondside surface part 816 may protrude in the sideward direction.

The second lead frame 820 may be disposed around at least side portionof the first lead frame 810. The second lead frame 820 may include asecond upper surface part 822 and a third side surface part 824. Thesecond upper surface part 822 may be divided into a first portion 832and a second portion 834 according to positions disposed around thefirst upper surface part 812.

The second portion 834 of the second upper surface part 822 may beopposite a second side portion of the first upper surface part 812. Thefirst portion 832 of the second upper surface part 822 may be connectedto one end of the second portion 834, and may correspond to or beopposite a third side portion of the first upper surface part 812. Thethird side portion may be vertical to the first side portion or thesecond side portion.

The second portion 834 of the second upper surface part 822 may includesecond protrusions 813 and 814 corresponding to the first depressions803 and 804. The second protrusions 813 and 814 are areas for wirebonding with the first light emitting chip 642 and the second lightemitting chip 644, and are located between the first light emitting chip642 and the second light emitting chip 644, thus facilitating wirebonding with the first light emitting chip 642 and the second lightemitting chip 644.

The third side surface part 824 may be bent downwardly from the secondupper surface part 822 at a designated angle (for example, 90°). Forexample, the third side surface part 824 may be bent from one sideportion of the first portion 832 of the second upper surface part 822.The second side surface part 816 and the third side surface part 824 maybe symmetrical with respect to the first side surface part 814. In orderto improve coupling with the package body 610 and air tightness to blockmoisture, the lower end portion of the side surface of the third sidesurface part 824 may protrude in the sideward direction. The first sidesurface part 814, the second side surface part 816 and the third sidesurface part 824 may be exposed to the same side surface of the packagebody 610.

FIG. 41 is a perspective view of a light emitting device package 200-2in accordance with another embodiment, FIG. 42 is a top view of thelight emitting device package 200-2 shown in FIG. 41, FIG. 43 is a frontview of the light emitting device package 200-2 shown in FIG. 41, FIG.44 is a cross-sectional view of the light emitting device package 200-2shown in FIG. 41, taken along the line c-d, and FIG. 45 is a perspectiveview illustrating a first lead frame 620′ and a second lead frame 630′shown in FIG. 41. Some parts in this embodiment which are substantiallythe same as those shown in FIGS. 28 to 32 are denoted by the samereference numerals even though they are depicted in different drawings,and redundant description of parts in the above-mentioned descriptionwill be omitted or briefly given.

With reference to FIGS. 41 to 45, the first lead frame 620′ of the lightemitting device package 200-2 may include a first upper surface part 932and a first side surface part 934. Differently from the first uppersurface part 712 shown in FIG. 32, the first upper surface part 932shown in FIG. 45 does not include a depression. Further, a second uppersurface 942 of the second lead frame 630′ may have a similar structureto the structure in which the second portion 742-2 of the second uppersurface part 742 shown in FIG. 32 is omitted.

The first side surface part 934 may have the same structure as the firstside surface part 714 shown in FIG. 32. The length P1 of the first uppersurface part 932 in the first direction may be smaller than the lengthof the first upper surface part 712 shown in FIG. 32, and the length J2of the first upper surface part 932 in the second direction may begreater than the length J1 of the first upper surface part 712. Forexample, the length P1 of the first upper surface part 932 in the firstdirection may be 4.8 mm˜4.9 mm, and the length J2 of the first uppersurface part 932 in the second direction may be 0.67 mm˜0.77 mm.Therefore, since the area of the first upper surface part 932 shown inFIG. 41 is greater than the area of the first upper surface part 712shown in FIG. 32, the light emitting device package 200-2 in accordancewith the embodiment of FIG. 41 may mount light emitting chips having alarger size. The sizes of the first side surface part 944, through holes722 and 724 and connection parts may be equal to those shown in FIG. 33.

The second lead frame 630′ may include the second upper surface part 942and a second side surface part 944. The second upper surface part 942may include a first portion 942-1 disposed around a third side portionof the first upper surface part 932 and a second portion 942-2 disposedaround a fourth side portion of the first upper surface part 932. Thethird side portion of the first upper surface part 932 may be a sideportion vertical to a first side portion of the first upper surface part932, or the fourth side portion of the first upper surface part 932 maybe a side portion opposite the third side portion of the first uppersurface part 932.

The first portion 942-1 and the second portion 942-2 of the second uppersurface part 942 may be separated from each other, and may beelectrically isolated from each other.

The second side surface part 944 may include a first portion 944-1connected to the first portion 942-1 of the second upper surface part942, and a second portion 944-2 connected to the second portion 942-2 ofthe second upper surface part 942. However, the length P2 of the firstportion 942-1 and the second portion 942-2 of the second upper surfacepart 942 in the first direction may be greater than the length H2 of thefirst portion 742-1 and the third portion 742-3 of the second uppersurface part 742 shown in FIG. 32 in the first direction.

For example, the length P2 of the first portion 942-1 and the secondportion 942-2 of the second upper surface part 942 in the firstdirection may be 1.04 mm˜1.14 mm, and the length P2 of the first portion942-1 and the second portion 942-2 of the second upper surface part 942in the second direction may be 0.45 mm˜0.55 mm.

The length S22 of protrusions of the first upper surface part 932protruding to support the first lead frame 620′ of a lead frame array inthe first direction may be 0.14 mm˜0.24 mm.

A first light emitting chip 642 may be electrically connected to thefirst portion 942-1 of the second upper surface part 942 by a first wire653, and a second light emitting chip 644 may be electrically connectedto the second portion 942-2 of the second upper surface part 942 by asecond wire 655.

The first light emitting chip 642 and the second light emitting chip 644may emit light of the same wavelength. For example, the first lightemitting chip 642 and the second light emitting chip 644 may be redlight emitting chips emitting red light.

Further, the first light emitting chip 642 and the second light emittingchip 644 may emit light of different wavelengths. For example, the firstlight emitting chip 642 may be a red light emitting chip, the secondlight emitting chip 644 may be a yellow light emitting chip, and thefirst light emitting chip 642 and the second light emitting chip 644mounted on the light emitting device package 200-2 in accordance withthis embodiment may be individually operated.

First power (for example, negative (−) power) may be supplied to thefirst lead frame 620′, and second power for example, positive (+) power)may be supplied to the second lead frame 630′. Since the second leadframe 630′ is divided into two portions (942-1, 944-1, and 942-2, 944-2)electrically isolated from each other, the first lead frame 620′ is usedas a common electrode and second power is individually supplied to thefirst portion 942-1 and the second portion 942-2 of the second uppersurface part 942 of the second lead frame 630′, thereby individuallyoperating the first light emitting chip 642 and the second lightemitting chip 644.

Therefore, if the light emitting device package 200-2 shown in FIG. 41is mounted on the light source modules 100-1 to 100-21 in accordancewith the above-described embodiments, the light source modules 100-1 to100-21 may generate surface light of various colors. For example, ifonly the first light emitting chip 642 is operated, the light sourcemodules 100-1 to 100-21 in accordance with the above-describedembodiments may generate red surface light, and if only the second lightemitting chip 644 is operated, the light source modules 100-1 to 100-21in accordance with the above-described embodiments may generate yellowsurface light.

FIG. 46 is a graph illustrating measured temperatures of light emittingdevice packages 200-1 and 200-2 in accordance with the embodiments. Themeasured temperatures shown in FIG. 46 represent temperatures of thelight emitting chips when the light emitting device packages 200-1 and200-2 emit light.

Case 1 represents the measured temperature of the light emitting chipsif the length of a first portion and a second portion of a first leadframe in the first direction is equal to the length of a third portion,case 2 represents the measured temperature of the light emitting chipsshown in FIG. 26, and case 3 represents the measured temperature of thelight emitting chips shown in FIG. 39.

With reference to FIG. 46, the measured temperature t1 of case 1 is44.54□, the measured temperature t2 of case 2 is 43.66□, and themeasured temperature t3 of case 3 is 43.58□.

Therefore, since the light source modules in accordance with theembodiments have improved heat dissipation effects by changing designsof the connection parts 732, 734 and 736 of the first side surface part714 of the first lead frame 620, rise of the temperature of the lightemitting chips 640 mounted on the light emitting device packages 200-1and 200-2 may be suppressed when the light emitting device packages200-1 and 200-2 emit light, thereby preventing brightness reduction andgeneration of wavelength shift.

FIG. 47 is a cross-sectional view of a light emitting chip shown 640 inFIG. 28 in accordance with one embodiment. The light emitting chip 640shown in FIG. 47 may be a vertical type chip which emits red lighthaving a wavelength range of, for example, 600 nm˜690 nm.

With reference to FIG. 47, the light emitting chip 640 includes a secondelectrode layer 1801, a reflective layer 1825, a light emittingstructure 1840, a passivation layer 1850, and a first electrode layer1860.

The second electrode layer 1801 together with the first electrode layer1860 provides power to the light emitting structure 1840. The secondelectrode layer 1801 may include an electrode material layer 1810 toinject current, a support layer 1815 located on the electrode materiallayer 1810, and a bonding layer 1820 located on the support layer 1815.The second electrode layer 1801 may be bonded to the first lead frame620, for example, the first upper surface part 712, of the lightemitting device package 200-1 shown in FIG. 32.

The electrode material layer 1810 may be formed of Ti/Au, and thesupport layer 1815 may be formed of metal or a semiconductor material.Further, the support layer 1815 may be formed of a material having highelectrical conductivity and high thermal conductivity. For example, thesupport layer 1815 may be formed of metal including at least one ofcopper (Cu), a copper alloy, gold (Au), nickel (Ni), molybdenum (Mo) andcopper-tungsten (Cu—W), or a semiconductor including at least one of Si,Ge, GaAs, ZnO and SiC.

The bonding layer 1820 is disposed between the support layer 1815 andthe reflective layer 1835, and serves to bond the support layer 1815 tothe reflective layer 1825. The bonding layer 1820 may include a bondingmetal material, for example, at least one of In, Sn, Ag, Nb, Pd, Ni, Auand Cu. Since the bonding layer 1820 is formed to bond the support layer1815 to the reflective layer 1825, the bonding layer 1820 may be omittedif the support layer 1815 is formed by plating or deposition.

The reflective layer 1825 is disposed on the bonding layer 1820. Thereflective layer 1825 may reflect light incident from the light emittingstructure 1840, thus improving light extraction efficiency. Thereflective layer 1825 may be formed of a reflective metal material, forexample, metal including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg,Zn, Pt, Au and Hf, or an alloy thereof.

Further, the reflective layer 1825 may be formed in a single layeredstructure or a multi-layered structure using conductive oxide layers,for example, indium zinc oxide (IZO), indium zinc tin oxide (IZTO),indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO),indium gallium tin oxide (IGTO), aluminum zinc oxide (AZO) and antimonytin oxide (ATO). Further, the reflective layer 1825 may be formed in amulti-layered structure including metal and conductive oxides, such asIZO/Ni, AZO/Ag, IZO/Ag/Ni and AZO/Ag/Ni.

An Ohmic region 1830 may be located between the reflective layer 1825and the light emitting structure 1840. The Ohmic region 1830 is a regionwhich is in Ohmic contact with the light emitting structure 1840, andserves to effectively supply power to the light emitting structure 1840.

The Ohmic region 1830 may be formed through Ohmic contact between thelight emitting structure 1840 and an Ohmic contact material, forexample, a material including at least one of Be, Au, Ag, Ni, Cr, Ti,Pd, Ir, Sn, Ru, Pt and Hf. For example, the material forming the Ohmicregion 1830 may include AuBe, and may be provided in a dot shape.

The light emitting structure 1840 may include a window layer 1842, asecond semiconductor layer 1844, an active layer 1846 and a firstsemiconductor layer 1848. The window layer 1842 may be a semiconductorlayer disposed on the reflective layer 1825, and may be formed of GaP.

The second semiconductor layer 1844 is disposed on the window layer1842. The second semiconductor layer 1844 may be formed of a group 3-5or group 2-6 compound semiconductor, and may be doped with a secondconductivity-type dopant. For example, the second semiconductor layer1844 may be formed of one of AIGaInP, GaInP, GaN, AlN, AlGaN, InGaN,InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs and GaAsP, and may be doped witha P-type dopant (for example, Mg, Zn, Ca, Sr or Ba).

The active layer 1846 may be disposed between the second semiconductorlayer 1844 and the first semiconductor layer 1848, and may generatelight using energy generated during recombination of electrons and holesprovided from the second semiconductor layer 1844 and the firstsemiconductor layer 1848.

The active layer 1846 may be formed of a group 3-5 or group 2-6 compoundsemiconductor, and may be formed in a single quantum well structure, amulti-quantum well structure, a quantum wire structure or a quantum dotstructure.

For example, the active layer 1846 may be formed in a single quantum ormulti-quantum well structure including well layers and barrier layers.The well layers may be formed of a material having a lower energy bandgap than the barrier layers. For example, the active layer 1846 may beformed of AIGaInP or GaInP.

The first semiconductor layer 1848 may be formed of a compoundsemiconductor. The first semiconductor layer 1848 may be formed of agroup 3-5 or group 2-6 compound semiconductor, and may be doped with afirst conductivity-type dopant. For example, the first semiconductorlayer 1848 may be formed of one of AIGaInP, GaInP, GaN, AlN, AlGaN,InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs and GaAsP, and may bedoped with an N-type dopant (for example, Si, Ge or Sn).

The light emitting structure 1840 may emit red light having a wavelengthrange of 600 nm˜690 nm, and the first semiconductor layer 1848, theactive layer 1846 and the second semiconductor layer 1844 may havecompositions which may emit red light. In order to increase lightextraction efficiency, a roughness 1870 may be formed on the uppersurface of the first semiconductor layer 1848.

The passivation layer 1850 is disposed on the side surface of the lightemitting structure 1840. The passivation layer 1850 serves toelectrically protect the light emitting structure 1840. The passivationlayer 1850 may be formed of an insulating material, for example, SiO2,SiOx, SiOxNy or Al2O3. The passivation layer 1850 may be disposed on atleast portion of the upper surface of the first semiconductor layer1848.

The first electrode layer 1860 may be disposed on the firstsemiconductor layer 1848, and may have a designated pattern. The firstelectrode layer 1860 may be formed in a single layered structure or amulti-layered structure. For example, the first electrode layer 1860 mayinclude a first layer 1862, a second layer 1864 and a third layer 1866which are sequentially stacked. The first layer 1862 may be in Ohmiccontact with the first semiconductor layer 1848, and may be formed ofGaAs. The second layer 1864 may be formed of an AuGe/Ni/Au alloy. Thethird layer 1866 may be formed of a Ti/Au alloy.

As shown in FIGS. 28 and 41, the first electrode layer 1860 may beelectrically bonded to the second lead frame 630 or 630′ by the wire652, 653, 654 or 655.

In general, when the temperature of the light emitting chip rises,wavelength shift is generated and brightness is reduced. As compared toa blue LED emitting blue light and amber LED emitting yellow light, ared LED emitting red light more severely generate wavelength shift andreduce brightness according to temperature rise. Therefore, in a lightemitting device package and a light source module using red lightemitting chips, it is important to take measures to dissipate heat tosuppress rise of the temperature of the light emitting chips.

The light source modules 100-1 to 100-21 and the light emitting devicepackages 200-1 and 200-2 included in the light emitting lamp 1 inaccordance with the embodiment may improve light dissipation efficiency,as described above, and may thus suppress rise of the temperature oflight emitting chips even if red light emitting chips are used, therebysuppressing wavelength shift and brightness reduction.

FIG. 48 is an exploded perspective view of a light emitting lamp 2 inaccordance with another embodiment. With reference to FIG. 48, the lightemitting lamp 2 includes a housing 1310, a light source module 1320, adiffusion plate 1330, and a micro-lens array 1340.

The housing 1310 may accommodate the light source module 1320, thediffusion plate 1330 and the micro-lens array 1340, and may be formed ofa light transmitting material.

The light source module 1320 may be one of the light source modules100-1 to 100-21 in accordance with the above-described embodiments.Further, the light source module 1320 may be one of the light sourcemodules 100-1 to 100-3, 100-7 and 100-8, 100-12 and 100-13, and 100-20excluding the diffusion plate 70 from among the light source modules100-1 to 100-21 in accordance with the above-described embodiments.Further, the light source module 1320 may have a structure in which thediffusion plate 70 is omitted from the light source modules 100-4 to100-6, 100-9 to 100-11, and 100-14 to 100-21.

The diffusion plate 1330 may serve to uniformly diffuse light havingpassed through the light source module 1320 throughout the overallsurface. The diffusion plate 1330 may be formed of the same material asthe diffusion plate 70, but the disclosure is not limited thereto. Inaccordance with another embodiment, the diffusion plate 1330 may beomitted.

The micro-lens array 1340 may have a structure in which a plurality ofmicro-lenses 1344 is disposed on a base film 1342. The respectivemicro-lenses 1344 may be separated from each other by a predeterminedinterval. The base film 1342 between the respective micro-lenses 1344may be flat, and the respective micro-lenses 1344 may be separated fromeach other by a pitch of 50˜500 μm.

Although FIG. 48 illustrates the diffusion plate 1330 and the micro-lensarray 1340 as being separately provided, another embodiment may describethe diffusion plate 1330 and the micro-lens array 1340 as beingintegrated.

FIG. 50 illustrates a tail lamp 900-2 for vehicles in accordance withone embodiment, and FIG. 51 illustrates a general tail lamp forvehicles.

With reference to FIG. 50, the tail lamp 900-2 for vehicles may includea first light source module 952, a second light source module 954, athird light source module 956 and a housing 970.

The first light source module 952 may be a light source serving as adirection indicator lamp, the second light source module 954 may be alight source serving as a vehicle side lamp, the third light sourcemodule 956 may be a light source serving as a stop lamp, but thedisclosure is not limited thereto and the functions thereof may beexchanged.

The housing 970 accommodates the first to third light source modules952, 954 and 956, and may be formed of a light transmitting material.The housing 970 may be bent according to the design of a vehicle body.At least one of the first to third light source modules 952, 954 and 956may be one of the light source modules 100-1 to 100-21 in accordancewith the above-described embodiments.

In the case of a tail lamp, a driver may view the front at a longdistance only if the light intensity during stoppage of a vehicle ismore than 110 cd, and the tail lamp generally requires the lightintensity more than such an intensity by 30%. Further, in order tooutput light of the intensity more than such an intensity by 30%, thenumber of light emitting device packages applied to the light sourcemodule 952, 954 or 956 needs to be increased by 25%˜35%, or output ofthe respective light emitting device packages needs to be increased by25%˜35%.

If the number of the light emitting device packages is increased, it maybe difficult to manufacture the light source module due to restrictionof a disposition space. Therefore, a desired intensity (for example, 110cd or more) of light may be obtained with a small number of the lightemitting device packages by increasing output of the respective lightemitting device packages mounted on the light source module. In general,since a value obtained by multiplying the output W of each of lightemitting device packages and the number N of the light emitting devicepackages becomes the overall output of the light source module, theproper output and number of the light emitting device packages accordingto the area of the light source module may be set in order to obtain adesired light intensity.

For example, in the case of light emitting device packages having powerconsumption of 0.2 Watts and output of 13 lm, 37˜42 light emittingdevice packages may be disposed in a designated area to generate a lightintensity of about 100 cd. However, in the case of light emitting devicepackages having power consumption of 0.5 Watts and output of 30 lm, only13˜15 light emitting device packages may be disposed in the same area togenerate a similar light intensity. The number of light emitting devicepackages to be disposed on a light source module having a designatedarea in order to obtain a designated output may be determined by anarrangement pitch, a content of a light diffusion material within alight guide layer and a pattern shape of a reflective layer. Here, thepitch may be a distance from the central point of one of two neighboringlight emitting device packages to the central point of the other one ofthe two neighboring light emitting device packages.

When light emitting device packages are disposed in the light sourcemodule, the light emitting device packages are separated from each otherby a designated interval. Here, in the case of high output lightemitting device packages, the number of the light emitting devicepackages to be disposed may be relatively reduced and the light emittingdevice packages may be disposed by a large interval therebetween, andthus a space may be effectively used. Further, if high output lightemitting device packages are disposed by a small interval therebetween,a higher light intensity may be obtained as compared to arrangement ofhigh output light emitting device packages by a large intervaltherebetween.

FIGS. 52A and 52B illustrate intervals between light emitting devicepackages of light source modules used in tail lamps for vehicles inaccordance with embodiments. For example, FIG. 52A may illustrate thefirst light source module 952 shown in FIG. 50, and FIG. 52B mayillustrate the second light source module 954 shown in FIG. 50.

With reference to FIGS. 52A and 52B, light emitting device packages 99-1to 99-n (n being a natural number >1) or 98-1 to 98-m (m being a naturalnumber >1) separated from each other may be disposed on a substrate 10-1or 10-2.

Intervals (for example, ph1, ph2 and ph3, or pc1, pc2 and pc3) betweentwo neighboring light emitting device packages may be different, and maybe in the range of 8˜30 mm.

The reason for this is that if the arrangement intervals (for example,ph1, ph2 and ph3, or pc1, pc2 and pc3) are less than 8 mm although thearrangement intervals may be changed according to consumption power ofthe light emitting device packages 99-1 to 99-n or 98-1 to 98-m,interference of light from the neighboring light emitting devicepackages (for example, 99-3 or 99-4) occurs and a visible light regionmay be generated. Further, if the arrangement intervals (for example,ph1, ph2 and ph3, or pc1, pc2 and pc3) are more than 30 mm, a darkregion may be generated due to an area which light does not reach.

As described above, since the light source modules 100-1 to 100-21 haveflexibility and may be easily mounted on the bent housing 970, the taillamp 900-2 for vehicles in accordance with the embodiment may improve adegree of freedom in design.

Further, since the light source modules 100-1 to 100-21 have a structurewith improved heat dissipation efficiency, the tail lamp 900-2 forvehicles in accordance with the embodiment may prevent generation ofwavelength shift and brightness reduction.

The general tail lamp for vehicles shown in FIG. 51 is a point lightsource and may thus generate partial spots 962 and 964 on a lightemission surface during emission of light, but the tail lamp 900-2 forvehicles in accordance with the embodiment is a surface light source andmay thus achieve uniform brightness and luminous intensity throughout alight emission surface.

As is apparent from the above description, a light emitting lamp inaccordance with one embodiment may achieve a thin profile, improve adegree of freedom in product design and heat dissipation efficiency, andsuppress wavelength shift and brightness reduction.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the disclosure. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A light emitting lamp comprising: a light sourcemodule includes a plurality of sub-light modules being separated fromeach other and combined with each other; and a housing accommodating thelight source module, wherein the plurality of sub-light source modulesincludes: a substrate; at least one light source disposed on thesubstrate; a light guide layer disposed on the substrate burying the atleast one light source; at least one connector provided on the substrateand electrically connected to the light source; and a coupling fixingpart connecting another sub-light source.
 2. The light emitting lampaccording to claim 1, wherein the coupling fixing part is protrusionprotruding from a side surface of the light guide layer or depressionformed at the side surface of the light guide layer.
 3. The lightemitting lamp according to claim 1, wherein connectors of the pluralityof sub-light source modules electrically are connected with each other.4. The light emitting lamp according to claim 1, wherein the pluralityof sub-light source modules include: a first sub-light source moduleincluding a first connector; and a second sub-light source moduleincluding a second connector electrically connecting the first connectorand a third connector for connecting to the outside.
 5. The lightemitting lamp according to claim 4, wherein the first connector iselectrically connected with the light source of the first sub-lightsource module and the second and third connectors are electricallyconnected with the light source of the second sub-light source module.6. The light emitting lamp according to claim 4, wherein a firstcoupling fixing part of the first sub-light source module and a secondcoupling fixing part of the second sub-light source module is fixedthrough male and female screw connection.
 7. The light emitting lampaccording to claim 1, wherein the at least one light source includes: abody having a cavity; a first lead frame including a first end exposedto the cavity and a second end passing through the body and exposed to afirst surface of the body; a second lead frame including a first endexposed to one portion of the first surface of the body, a second endexposed to another portion of the first surface of the body, and a thirdend exposed to the cavity; and at least one light emitting chipincluding a first semiconductor layer, an active layer and a secondsemiconductor layer, and disposed on the first lead frame.
 8. The lightemitting lamp according to claim 7, wherein the second end of the firstlead frame is positioned directly between the first and second ends ofthe second lead frame, and the third end of the second lead frameconnects the first end of the second lead frame to the second end of thesecond lead frame.
 9. The light emitting lamp according to claim 8,wherein the first lead frame includes: a first upper surface part whichis exposed to the cavity and on which the at least one light emittingchip is disposed; and a first side surface part bent from a first sideportion of the first upper surface part and exposed to the surface ofthe body.
 10. The light emitting lamp according to claim 9, wherein thefirst lead frame further includes at least one through hole formedadjacent to a boundary part between the first upper surface part and thefirst side surface part.
 11. The light emitting lamp according to claim10, wherein the first lead frame further includes connection partsconnecting the first upper surface part and the first side surface part,and the at least one through hole is located between the connectionparts.
 12. The light emitting lamp according to claim 10, wherein thesecond lead frame includes: a second upper surface part disposed aroundat least one side portion of the first upper surface part and exposed tothe cavity of the body; and a second side surface part bent from thesecond upper surface part and exposed respectively to the one portionand the another portion of the surface of the body.
 13. The lightemitting lamp according to claim 1, wherein the light source modulefurther includes a heat dissipation member disposed on the lower surfaceof the substrate.
 14. The light emitting lamp according to claim 1,wherein the substrate includes at least one via hole.
 15. The lightemitting lamp according to claim 1, wherein the light source modulefurther includes a reflective sheet disposed between the substrate andthe light guide layer.
 16. The light emitting lamp according to claim15, wherein the light source module further includes reflective patternsdisposed on the reflective sheet.
 17. The light emitting lamp accordingto claim 16, wherein the light source module further include: a firstoptical sheet disposed on the light guide layer and dispersing lightemitted from the light guide layer; and a second optical sheet disposedon the first optical sheet and the optical patterns.
 18. The lightemitting lamp according to claim 17, wherein the light source modulefurther includes optical patterns disposed on the first optical sheetand blocking or reflecting light emitted from the at least one lightsource.
 19. The light emitting lamp according to claim 17, wherein thelight source module further includes a diffusion plate disposed on thesecond optical sheet.
 20. The light emitting lamp according to claim 19,further comprising a plurality of lenses disposed on the diffusionplate.